Inventor · disambiguated record
Richard L. Bersin
Also filed as: BERSIN RICHARD L
12 granted patents·775 citations·filing 1977–1996
94Inventor score
Files withEMERGENT TECHNOLOGIES CORP3ULVAC TECHNOLOGIES INC3BRANSON INT PLASMA2DIONEX CORP2PERKIN ELMER CORP1
Top patents by PatentIndex Score
12 records- 0194US4148705AGas plasma reactor and processDIONEX CORP·Filed 1977·Granted Apr 10, 1979·58 cites·16 claims
- 0289US5882489AProcesses for cleaning and stripping photoresist from surfaces of semiconductor wafersULVAC TECHNOLOGIES INC·Filed 1996·Granted Mar 16, 1999·124 cites·27 claims
- 0389US4303467AProcess and gas for treatment of semiconductor devicesBRANSON INT PLASMA·Filed 1977·Granted Dec 1, 1981·81 cites·17 claims
- 0488US4687544AMethod and apparatus for dry processing of substratesEMERGENT TECHNOLOGIES CORP·Filed 1986·Granted Aug 18, 1987·91 cites·22 claims
- 0586US4699689AMethod and apparatus for dry processing of substratesEMERGENT TECHNOLOGIES CORP·Filed 1986·Granted Oct 13, 1987·80 cites·4 claims
- 0682US5228052APlasma ashing apparatusULVAC CORP·Filed 1991·Granted Jul 13, 1993·46 cites·7 claims
- 0781US4689112AMethod and apparatus for dry processing of substratesEMERGENT TECHNOLOGIES CORP·Filed 1986·Granted Aug 25, 1987·59 cites·32 claims
- 0880US5795831ACold processes for cleaning and stripping photoresist from surfaces of semiconductor wafersULVAC TECHNOLOGIES INC·Filed 1996·Granted Aug 18, 1998·67 cites·18 claims
- 0980US5099100APlasma etching device and processBRANSON INT PLASMA·Filed 1989·Granted Mar 24, 1992·48 cites·21 claims
- 1078US4364413AMolar gas-flow controllerPERKIN ELMER CORP·Filed 1981·Granted Dec 21, 1982·38 cites·9 claims
- 1176US5908319ACleaning and stripping of photoresist from surfaces of semiconductor wafersULVAC TECHNOLOGIES INC·Filed 1996·Granted Jun 1, 1999·54 cites·30 claims
- 1272US4127437AProcess for etching SiO2 utilizing HF vapor and an organic catalystDIONEX CORP·Filed 1977·Granted Nov 28, 1978·29 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →