Inventor · disambiguated record
Rishi Bhooshan
Also filed as: BHOOSHAN RISHI
12 granted patents·10 pending applications·56 citations·filing 2004–2024
87Inventor score
Top patents by PatentIndex Score
22 records- 0195US9455233B1System for preventing tampering with integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 27, 2016·23 cites·17 claims
- 0290US12123911B1Integrated circuit with timing correction circuitryNXP USA INC·Filed 2023·Granted Oct 22, 2024·2 cites·20 claims
- 0384US8896086B1System for preventing tampering with integrated circuitARORA MOHIT·Filed 2013·Granted Nov 25, 2014·9 cites·10 claims
- 0480US9337140B1Signal bond wire shieldFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 10, 2016·4 cites·8 claims
- 0567US9196598B1Semiconductor device having power distribution using bond wiresKUMAR SHAILESH·Filed 2014·Granted Nov 24, 2015·2 cites·6 claims
- 0663US7315992B2Electro-migration (EM) and voltage (IR) drop analysis of integrated circuit (IC) designsTEXAS INSTRUMENTS INC·Filed 2004·Granted Jan 1, 2008·15 cites·24 claims
- 0762US2025210464A1Semiconductor circuit with selective backside power and ground distribution and maximum area decoupling capacitorsNXP BV·Filed 2024·Application pending·0 cites
- 0862US2025052798A1Semiconductor device having electromagnetic interference (emi) sensors and a sensing circuit to detect emi attacksNXP BV·Filed 2024·Application pending·0 cites
- 0961US2025261384A1Electronic devices including a sidewall structure and methods of formation thereofNXP BV·Filed 2024·Application pending·0 cites
- 1061US2025210463A1Semiconductor die with buried electrical interconnectionsNXP BV·Filed 2024·Application pending·0 cites
- 1159US12462850B2System and method for improving safety of integrated circuitsNXP BV·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 1257US11449657B2Integrated input/output pad and analog multiplexer architectureNXP USA INC·Filed 2020·Granted Sep 20, 2022·0 cites·19 claims
- 1355US9147656B1Semiconductor device with improved shieldingVARSHNEY SUMIT·Filed 2014·Granted Sep 29, 2015·1 cites·13 claims
- 1454US11694970B2Plated pillar dies having integrated electromagnetic shield layersNXP BV·Filed 2021·Granted Jul 4, 2023·0 cites·15 claims
- 1548US2025210958A1Circuit for detection and mitigation of device damage to an electronic deviceNXP BV·Filed 2024·Application pending·0 cites
- 1645US11488904B2System and method for reducing mutual coupling for noise reduction in semiconductor device packagingNXP BV·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 1745US2016163671A1Integrated circuit package with power platesKUMAR SHAILESH·Filed 2014·Application pending·0 cites
- 1843US2015221592A1Semiconductor device with package-level decoupling capacitors formed with bond wiresVERMA CHETAN·Filed 2014·Application pending·0 cites
- 1942US2015214167A1Semiconductor die with variable length bond padBHOOSHAN RISHI·Filed 2014·Application pending·0 cites
- 2041US2007094630A1Power grid design in an integrated circuitTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 2139US9494987B2Processing system with low power wake-up padTRAN DZUNG T·Filed 2013·Granted Nov 15, 2016·0 cites·20 claims
- 2238US2014332811A1Semiconductor device with bond and probe padsKUMAR NAVEEN·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →