Inventor · disambiguated record
Richard J. Bono
Also filed as: BONO RICHARD J
1 granted patent·3 pending applications·0 citations·filing 2006–2025
9Inventor score
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4 records- 0140US2025385236A1Discrete semiconductor device package with integrated temperature sensorLITTELFUSE SEMICONDUCTOR WUXI CO LTD·Filed 2025·Application pending·0 cites
- 0235US2007236849A1Leadless integrated circuit protection deviceLITTELFUSE INC·Filed 2006·Application pending·0 cites
- 0331US2016141275A1Semiconductor power module using discrete semiconductor componentsLITTELFUSE INC·Filed 2014·Application pending·0 cites
- 0421US9711424B2Low thermal stress package for large area semiconductor diesBONO RICHARD J·Filed 2013·Granted Jul 18, 2017·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →