Inventor · disambiguated record
Richard E. Bornfreund
Also filed as: BORNFREUND RICHARD E
13 granted patents·84 citations·filing 2006–2021
89Inventor score
Top patents by PatentIndex Score
13 records- 0195US7629582B2Dual band imager with visible or SWIR detectors combined with uncooled LWIR detectorsRAYTHEON CO·Filed 2006·Granted Dec 8, 2009·52 cites·18 claims
- 0290US8471204B2Monolithic electro-optical polymer infrared focal plane arrayBORNFREUND RICHARD E·Filed 2010·Granted Jun 25, 2013·11 cites·15 claims
- 0380US9029783B2Multilayered microbolometer film depositionCANNATA ROBERT F·Filed 2011·Granted May 12, 2015·5 cites·24 claims
- 0479US10153204B2Wafer level packaging of reduced-height infrared detectorsFLIR SYSTEMS·Filed 2015·Granted Dec 11, 2018·4 cites·18 claims
- 0577US9945729B2Systems and methods for enhanced bolometer responseFLIR SYSTEMS·Filed 2015·Granted Apr 17, 2018·3 cites·23 claims
- 0673US8552479B2Aluminum indium antimonide focal plane arrayBORNFREUND RICHARD E·Filed 2010·Granted Oct 8, 2013·1 cites·20 claims
- 0773US8552480B2Aluminum indium antimonide focal plane arrayBORNFREUND RICHARD E·Filed 2010·Granted Oct 8, 2013·1 cites·20 claims
- 0860US10971540B2Method and systems for coupling semiconductor substratesFLIR SYSTEMS·Filed 2016·Granted Apr 6, 2021·1 cites·20 claims
- 0959US8502147B2Microbolometer detector layerPETRAITIS YAROSLAVA·Filed 2011·Granted Aug 6, 2013·2 cites·23 claims
- 1057US8179529B1Alignment systems and methodsBERRY RONALD W·Filed 2008·Granted May 15, 2012·4 cites·20 claims
- 1155US11916039B2Semiconductor device interconnection systems and methodsTELEDYNE FLIR COMMERCIAL SYSTEMS INC·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 1238US10020343B2Wafer-level back-end fabrication systems and methodsFLIR SYSTEMS·Filed 2016·Granted Jul 10, 2018·0 cites·20 claims
- 1337US9822439B2Deposition systems and methodsFLIR SYSTEMS·Filed 2015·Granted Nov 21, 2017·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →