Inventor · disambiguated record
Rick Canham
Also filed as: CANHAM RICK
2 granted patents·3 pending applications·0 citations·filing 2008–2024
28Inventor score
Top patents by PatentIndex Score
5 records- 0157US2024357744A1Integrated circuit packages including carriers with incorporated substrates and interfacesINTEL CORP·Filed 2024·Application pending·0 cites
- 0253US2023395460A1Backside integrated torsion loading mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 0351US2024222288A1Socket interface frames for devices with improved-performance substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 0437US8151450B2Sliding package retention device for LGA socketsCANHAM RICK·Filed 2008·Granted Apr 10, 2012·0 cites·12 claims
- 0536US8904630B2Method of placing a chip assembly in a socket housingCANHAM RICK·Filed 2012·Granted Dec 9, 2014·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →