Inventor · disambiguated record
Richard Lee Carlson
Also filed as: CARLSON RICHARD LEE
2 granted patents·31 citations·filing 1997–2000
62Inventor score
Technology areasY10T
Files withIBM2
Top patents by PatentIndex Score
2 records- 0164US6093894AMulticonductor bonded connection assembly with direct thermal compression bonding through a base layerIBM·Filed 1997·Granted Jul 25, 2000·23 cites·6 claims
- 0258US6446335B1Direct thermal compression bonding through a multiconductor base layerIBM·Filed 2000·Granted Sep 10, 2002·8 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →