Inventor · disambiguated record
Ritwik Chatterjee
Also filed as: CHATTERJEE RITWIK
13 granted patents·1 pending application·99 citations·filing 2005–2018
90Inventor score
Top patents by PatentIndex Score
14 records- 0194US7799678B2Method for forming a through silicon via layoutFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Sep 21, 2010·44 cites·16 claims
- 0283US7422979B2Method of forming a semiconductor device having a diffusion barrier stack and structure thereofFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 9, 2008·14 cites·10 claims
- 0382US7993971B2Forming a 3-D semiconductor die structure with an intermetallic formationFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 9, 2011·16 cites·12 claims
- 0473US7572723B2Micropad for bonding and a method thereforFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 11, 2009·6 cites·18 claims
- 0572US8581383B23-D semiconductor die structure with containing feature and methodPOZDER SCOTT K·Filed 2010·Granted Nov 12, 2013·4 cites·20 claims
- 0670US7811932B23-D semiconductor die structure with containing feature and methodFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Oct 12, 2010·4 cites·9 claims
- 0762US10922151B2Unified events frameworkSAP SE·Filed 2018·Granted Feb 16, 2021·2 cites·20 claims
- 0862US7807572B2Micropad formation for a semiconductorFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Oct 5, 2010·2 cites·20 claims
- 0962US7579258B2Semiconductor interconnect having adjacent reservoir for bonding and method for formationFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 25, 2009·2 cites·10 claims
- 1061US8003517B2Method for forming interconnects for 3-D applicationsFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 23, 2011·2 cites·19 claims
- 1161US7763538B2Dual plasma treatment barrier film to reduce low-k damageFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 27, 2010·1 cites·19 claims
- 1258US7932175B2Method to form a viaFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Apr 26, 2011·1 cites·36 claims
- 1355US8586474B2Method to form a viaCHATTERJEE RITWIK·Filed 2011·Granted Nov 19, 2013·1 cites·20 claims
- 1442US2008113505A1Method of forming a through-substrate viaSPARKS TERRY G·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →