Inventor · disambiguated record

Rizza Lee Saga Cizek

Also filed as: CIZEK RIZZA LEE SAGA

2 granted patents·10 citations·filing 2013–2016

54Inventor score

Technology areasH10P H10W

Files withINVENSAS CORP2

Top patents by PatentIndex Score

2 records

0184US9087815B2Off substrate kinking of bond wireINVENSAS CORP·Filed 2013·Granted Jul 21, 2015·8 cites·20 claims
0276US9947641B2Wire bond support structure and microelectronic package including wire bonds therefromINVENSAS CORP·Filed 2016·Granted Apr 17, 2018·2 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →