Inventor · disambiguated record
Richard D. Cooper
Also filed as: COOPER RICHARD D
8 granted patents·1 pending application·129 citations·filing 1985–2004
87Inventor score
Files withRAYTECH INNOVATIVE SOLUTIONS I3RAYTECH INNOVATIVE SOLUTIONS L3ALLOMATIC IND INC1RAYTECH INNOVATION SOLUTIONS L1
Top patents by PatentIndex Score
9 records- 0185US6852020B2Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making sameRAYTECH INNOVATIVE SOLUTIONS I·Filed 2003·Granted Feb 8, 2005·38 cites·29 claims
- 0278US6899610B2Retaining ring with wear pad for use in chemical mechanical planarizationRAYTECH INNOVATIVE SOLUTIONS I·Filed 2002·Granted May 31, 2005·19 cites·40 claims
- 0375US4804466AFluid filter with internal spacerALLOMATIC IND INC·Filed 1985·Granted Feb 14, 1989·36 cites·14 claims
- 0470US7037184B2Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making sameRAYTECH INNOVATION SOLUTIONS L·Filed 2003·Granted May 2, 2006·17 cites·15 claims
- 0563US7025668B2Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafersRAYTECH INNOVATIVE SOLUTIONS L·Filed 2003·Granted Apr 11, 2006·10 cites·4 claims
- 0651US6863774B2Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making sameRAYTECH INNOVATIVE SOLUTIONS I·Filed 2002·Granted Mar 8, 2005·5 cites·1 claims
- 0750US6979256B2Retaining ring with wear pad for use in chemical mechanical planarizationRAYTECH INNOVATIVE SOLUTIONS L·Filed 2004·Granted Dec 27, 2005·4 cites·9 claims
- 0845US2005085169A1Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making sameFiled 2004·Application pending·0 cites
- 0936US6964601B2Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafersRAYTECH INNOVATIVE SOLUTIONS L·Filed 2003·Granted Nov 15, 2005·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →