Inventor · disambiguated record
Richard H. Estes
Also filed as: ESTES RICHARD H
12 granted patents·1 pending application·1,954 citations·filing 1989–2020
95Inventor score
Top patents by PatentIndex Score
13 records- 0198US6410415B1Flip chip mounting techniquePOLYMER FLIP CHIP CORP·Filed 2000·Granted Jun 25, 2002·249 cites·39 claims
- 0298US5196371AFlip chip bonding method using electrically conductive polymer bumpsEPOXY TECHNOLOGY INC·Filed 1991·Granted Mar 23, 1993·251 cites·19 claims
- 0398US5074947AFlip chip technology using electrically conductive polymers and dielectricsEPOXY TECHNOLOGY INC·Filed 1989·Granted Dec 24, 1991·260 cites·16 claims
- 0497US6189208B1Flip chip mounting techniquePOLYMER FLIP CHIP CORP·Filed 1999·Granted Feb 20, 2001·168 cites·27 claims
- 0597US5611140AMethod of forming electrically conductive polymer interconnects on electrical substratesEPOXY TECHNOLOGY INC·Filed 1995·Granted Mar 18, 1997·201 cites·2 claims
- 0697US5237130AFlip chip technology using electrically conductive polymers and dielectricsEPOXY TECHNOLOGY INC·Filed 1991·Granted Aug 17, 1993·207 cites·18 claims
- 0796US6219911B1Flip chip mounting techniquePOLYMER FLIP CHIP CORP·Filed 1999·Granted Apr 24, 2001·120 cites·8 claims
- 0895US6875212B2Curable media for implantable medical deviceVERTELINK CORP·Filed 2002·Granted Apr 5, 2005·318 cites·9 claims
- 0994US6138348AMethod of forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1999·Granted Oct 31, 2000·90 cites·13 claims
- 1087US5879761AMethod for forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1995·Granted Mar 9, 1999·44 cites·7 claims
- 1179US5918364AMethod of forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1997·Granted Jul 6, 1999·30 cites·14 claims
- 1278US8337556B2Curable media for implantable medical deviceSHAOLIAN SAMUEL M·Filed 2005·Granted Dec 25, 2012·16 cites·23 claims
- 1341US2022127509A1Compositions and methods for thermal management of textiles and foamsALEXIUM INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →