Inventor · disambiguated record
Rich Fogal
Also filed as: FOGAL RICH
68 granted patents·1 pending application·2,847 citations·filing 1990–2019
99Inventor score
Top patents by PatentIndex Score
69 records- 0199US5323060AMultichip module having a stacked chip arrangementMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jun 21, 1994·590 cites·5 claims
- 0298US7977597B2Wire bonders and methods of wire-bondingMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 12, 2011·107 cites·19 claims
- 0397US7227095B2Wire bonders and methods of wire-bondingMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 5, 2007·137 cites·37 claims
- 0497US6051886AAngularly offset stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 18, 2000·222 cites·6 claims
- 0596US5140404ASemiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tapeMICRON TECHNOLOGY INC·Filed 1991·Granted Aug 18, 1992·208 cites·15 claims
- 0694US5721452AAngularly offset stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1995·Granted Feb 24, 1998·150 cites·6 claims
- 0793US9595513B2Proximity coupling of interconnect packaging systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 14, 2017·11 cites·21 claims
- 0892US6563205B1Angularly offset and recessed stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1999·Granted May 13, 2003·115 cites·25 claims
- 0992US5874781AAngularly offset stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 23, 1999·114 cites·12 claims
- 1091US5886412AAngularly offset and recessed stacked die multichip deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 23, 1999·113 cites·6 claims
- 1191US5322207AMethod and apparatus for wire bonding semiconductor dice to a leadframeMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jun 21, 1994·141 cites·15 claims
- 1291US5177032AMethod for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tapeMICRON TECHNOLOGY INC·Filed 1990·Granted Jan 5, 1993·105 cites·16 claims
- 1390US5963794AAngularly offset stacked die multichip device and method of manufactureMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 5, 1999·102 cites·25 claims
- 1489US5647528ABondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 15, 1997·60 cites·57 claims
- 1587US8354301B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2011·Granted Jan 15, 2013·7 cites·23 claims
- 1687US6068174ADevice and method for clamping and wire-bonding the leads of a lead frame one set at a timeMICRON TECHNOLOGY INC·Filed 1996·Granted May 30, 2000·56 cites·6 claims
- 1786US7868440B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 11, 2011·11 cites·13 claims
- 1885US10062678B2Proximity coupling of interconnect packaging systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 28, 2018·3 cites·14 claims
- 1983US5954842ALead finger clamp assemblyMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 21, 1999·60 cites·25 claims
- 2081US6000599ABondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 14, 1999·34 cites·19 claims
- 2179US6537400B1Automated method of attaching flip chip devices to a substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 25, 2003·20 cites·44 claims
- 2277US6334566B1Device and method for clamping and wire-bonding the leads of a lead frame one set at a timeMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 1, 2002·15 cites·1 claims
- 2376US6478211B2Device and method for clamping and wire-bonding the leads of a lead frame one set at a timeMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 12, 2002·13 cites·28 claims
- 2474US5758942AMechanical vision system using selective wavelength and brightness illuminationMICRON TECHNOLOGY INC·Filed 1995·Granted Jun 2, 1998·47 cites·7 claims
- 2574US5662261AWire bonding capillaryMICRON TECHNOLOGY INC·Filed 1995·Granted Sep 2, 1997·43 cites·20 claims
- 2672US6464123B2Bondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 15, 2002·9 cites·33 claims
- 2771US6435400B1Bondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 20, 2002·9 cites·13 claims
- 2870US6991970B2Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor deviceMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 31, 2006·14 cites·14 claims
- 2970US6047468ALead finger clamp assembly and method of stabilizing lead frame elementsMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 11, 2000·31 cites·17 claims
- 3069US6793749B2Automated method of attaching flip-chip devices to a substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 21, 2004·11 cites·12 claims
- 3168US5918107AMethod and system for fabricating and testing assemblies containing wire bonded semiconductor diceMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 29, 1999·31 cites·20 claims
- 3267US5813590AExtended travel wire bonding machineMICRON TECHNOLOGY INC·Filed 1995·Granted Sep 29, 1998·19 cites·9 claims
- 3367US5559366ALead finger tread for a semiconductor lead package systemMICRON TECHNOLOGY INC·Filed 1994·Granted Sep 24, 1996·35 cites·12 claims
- 3466US5905305ACondensed memory matrixMICRON TECHNOLOGY INC·Filed 1997·Granted May 18, 1999·20 cites·9 claims
- 3565US6196445B1Method for positioning the bond head in a wire bonding machineMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 6, 2001·16 cites·3 claims
- 3663US11398465B2Proximity coupling interconnect packaging systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 26, 2022·0 cites·16 claims
- 3763US6604671B2Bondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 12, 2003·5 cites·13 claims
- 3861US6390350B2Quick change precisorMICRON TECHNOLOGY INC·Filed 2001·Granted May 21, 2002·6 cites·22 claims
- 3961US6290116B1Bondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·13 cites·36 claims
- 4060US10381336B2Proximity coupling interconnect packaging systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 13, 2019·0 cites·17 claims
- 4160US6845898B2Bondhead lead clamp apparatusMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 25, 2005·4 cites·20 claims
- 4258US6325275B1Bondhead lead clamp apparatus and methodMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 4, 2001·11 cites·13 claims
- 4357US6662993B2Bondhead lead clamp apparatusMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 16, 2003·3 cites·33 claims
- 4456US6773523B2Automated method of attaching flip chip devices to a substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 10, 2004·5 cites·33 claims
- 4556US6117693ASystem for fabricating and testing assemblies containing wire bonded semiconductor diceMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 12, 2000·18 cites·18 claims
- 4655US8987885B2Packaged microdevices and methods for manufacturing packaged microdevicesMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 24, 2015·0 cites·9 claims
- 4754US5350106ASemiconductor wire bonding methodMICRON SEMICONDUCTOR INC·Filed 1993·Granted Sep 27, 1994·18 cites·10 claims
- 4852US6321970B1Wire bonding machineMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 27, 2001·2 cites·2 claims
- 4951US6467672B2Methods for clamping and wire-bonding the leads of a lead frame one set at a timeMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 22, 2002·2 cites·17 claims
- 5051US6299049B1Device and method for clamping and wire-bonding the leads of a lead frame one set at a timeMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 9, 2001·9 cites·17 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →