Inventor · disambiguated record
Richard L. Greeson
Also filed as: GREESON RICHARD L · GREESON RICHARD LESLIE
9 granted patents·102 citations·filing 1974–1983
88Inventor score
Top patents by PatentIndex Score
9 records- 0175US4511614ASubstrate having high absorptance and emittance black electroless nickel coating and a process for producing the sameBALL CORP·Filed 1983·Granted Apr 16, 1985·35 cites·19 claims
- 0261US3945111AMetallization system for semiconductor devices, devices utilizing such metallization system and method for making devices and metallization systemMOTOROLA INC·Filed 1974·Granted Mar 23, 1976·12 cites·5 claims
- 0356US3985515AMetallization system for semiconductor devices, devices utilizing such metallization system and method for making devices and metallization systemMOTOROLA INC·Filed 1974·Granted Oct 12, 1976·9 cites·11 claims
- 0449US3987217AMetallization system for semiconductor devices, devices utilizing such metallization system and method for making devices and metallization systemMOTOROLA INC·Filed 1974·Granted Oct 19, 1976·7 cites·3 claims
- 0546US4009299ATin strip formulation for metal to glass seal diodesMOTOROLA INC·Filed 1975·Granted Feb 22, 1977·10 cites·3 claims
- 0642US4187599ASemiconductor device having a tin metallization system and package containing sameMOTOROLA INC·Filed 1978·Granted Feb 12, 1980·10 cites·3 claims
- 0742US4077045AMetallization system for semiconductive devices, devices utilizing such metallization system and method for making devices and metallization systemMOTOROLA INC·Filed 1974·Granted Feb 28, 1978·5 cites·6 claims
- 0841US4146655AMethod for encapsulating a semiconductor diodeMOTOROLA INC·Filed 1978·Granted Mar 27, 1979·8 cites·3 claims
- 0928US3978517ATitanium-silver-palladium metallization system and process thereforMOTOROLA INC·Filed 1975·Granted Aug 31, 1976·6 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →