Inventor · disambiguated record
Richard J. Hill
Also filed as: HILL RICHARD J
64 granted patents·17 pending applications·126 citations·filing 2017–2025
98Inventor score
Top patents by PatentIndex Score
81 records- 0197US10083981B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 25, 2018·22 cites·17 claims
- 0297US9985049B1Arrays of elevationally-extending strings of memory cells and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2017·Granted May 29, 2018·21 cites·28 claims
- 0396US11037956B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 15, 2021·4 cites·24 claims
- 0495US10777576B1Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 15, 2020·12 cites·48 claims
- 0594US11948992B2Electronic devices comprising a dielectric material, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 2, 2024·5 cites·24 claims
- 0694US11456208B2Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·5 cites·31 claims
- 0793US10497715B2Memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 3, 2019·9 cites·3 claims
- 0892US11069687B2Integrated assemblies having shield lines between digit lines, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 20, 2021·3 cites·23 claims
- 0991US10770465B1Method used in forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 8, 2020·7 cites·34 claims
- 1091US2025393214A1Memory Arrays, and Methods of Forming Memory ArraysMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1190US11672120B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·2 cites·19 claims
- 1290US11404440B2Memory arraysMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 2, 2022·2 cites·27 claims
- 1389US10950618B2Memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 16, 2021·4 cites·32 claims
- 1488US11672118B2Electronic devices comprising adjoining oxide materials and related systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 6, 2023·2 cites·17 claims
- 1588US11081497B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 3, 2021·4 cites·30 claims
- 1688US10957681B1Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory arrayMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 23, 2021·4 cites·5 claims
- 1786US11690210B2Three-dimensional dynamic random-access memory arrayMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 27, 2023·4 cites·24 claims
- 1885US11107830B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 31, 2021·3 cites·30 claims
- 1985US10504917B2Arrays of elevationally-extending strings of memory cells and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 10, 2019·3 cites·31 claims
- 2085US2025301648A1Microelectronic devices including pillars with upper portions having perimeters interrputed by elongate isolation structuresLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 2183US12324154B2Microelectronic devices including pillars with partially-circular upper portions and circular lower portions, and related methodsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Jun 3, 2025·0 cites·19 claims
- 2283US12150303B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Nov 19, 2024·0 cites·18 claims
- 2383US11302708B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 12, 2022·2 cites·23 claims
- 2483US11227861B2Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory arrayMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 18, 2022·1 cites·8 claims
- 2580US10522395B1Methods of forming a patternMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 31, 2019·2 cites·17 claims
- 2679US11864386B2Memory arraysMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 2, 2024·0 cites·16 claims
- 2779US10923480B2Capacitance reduction in a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 16, 2021·2 cites·29 claims
- 2878US11244954B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 8, 2022·2 cites·30 claims
- 2977US11800717B2Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 3076US2025132248A1Memory devices including staircase structuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3176US2025107204A1Microelectronic devices with active source/drain contacts in trench in symmetrical dual-block structure, and related methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3275US12408341B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 2, 2025·0 cites·8 claims
- 3375US2024099007A1Memory devices and related electronic systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3472US11322516B2Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted May 3, 2022·0 cites·25 claims
- 3572US10304853B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted May 28, 2019·1 cites·13 claims
- 3671US2024121943A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3770US2023395723A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3869US11527620B2Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor materialMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 13, 2022·0 cites·19 claims
- 3968US12237259B2Electronic devices comprising multilevel bitlines, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 25, 2025·0 cites·28 claims
- 4068US11527550B2Memory array and a method used in forming a memory arrayMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 13, 2022·0 cites·13 claims
- 4167US12464713B2Memory circuitry comprising strings of memory cells and method used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 4267US11729982B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 15, 2023·0 cites·16 claims
- 4367US11728263B2Integrated assemblies having conductive-shield-structures between linear-conductive-structuresMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 4467US11670707B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 6, 2023·0 cites·20 claims
- 4567US11514953B2Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 29, 2022·0 cites·24 claims
- 4667US2025210511A1Electronic devices comprising multilevel bitlines, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4767US2023065142A1Integrated Assemblies, and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4866US12191249B2Microelectronic devices including staircase structures, and related memory devices, electronic systems, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 7, 2025·0 cites·24 claims
- 4966US11563031B2Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 24, 2023·0 cites·19 claims
- 5066US11393920B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 19, 2022·0 cites·28 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →