Inventor · disambiguated record
Rikiya Katoh
Also filed as: KATOH RIKIYA
4 granted patents·1 pending application·106 citations·filing 1997–2002
80Inventor score
Top patents by PatentIndex Score
5 records- 0185US6554180B1Lead-free solder pasteSENJU METAL INDUSTRY CO·Filed 2000·Granted Apr 29, 2003·37 cites·24 claims
- 0280US6503338B1Lead-free solder alloysSENJU METAL INDUSTRY CO·Filed 2000·Granted Jan 7, 2003·21 cites·35 claims
- 0366US6220501B1Method of joining metallic members, and joined metallic membersTOSHIBA KK·Filed 1998·Granted Apr 24, 2001·30 cites·25 claims
- 0465US6050480ASolder paste for chip componentsSENJU METAL INDUSTRY CO·Filed 1997·Granted Apr 18, 2000·18 cites·7 claims
- 0539US2003021719A1Lead-free solder alloysSENJU METAL INDUSTRY CO·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →