Inventor · disambiguated record
Rie Kuwahara
Also filed as: KUWAHARA RIE
0 granted patents·7 pending applications·0 citations·filing 2009–2012
Top patents by PatentIndex Score
7 records- 0157US2009263606A1Thermosetting adhesive or pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0246US2012270002A1Pressure-sensitive adhesive tape for flexible printed circuitHORIGUCHI HAKARU·Filed 2012·Application pending·0 cites
- 0345US2012052229A1Thermosetting adhesive tape or sheetKUWAHARA RIE·Filed 2011·Application pending·0 cites
- 0442US2012111612A1Thermosetting adhesive tape or sheet, and flexible printed circuit boardKUWAHARA RIE·Filed 2010·Application pending·0 cites
- 0541US2012009399A1Double-sided pressure-sensitive adhesive sheet for fixing flexible printed circuit board and method for manufacturing the sameNONAKA TAKAHIRO·Filed 2011·Application pending·0 cites
- 0633US2012055700A1Double-sided pressure-sensitive adhesive tape for fixing flexible printed circuit board and flexible printed circuit board with the sameHORIGUCHI HAKARU·Filed 2011·Application pending·0 cites
- 0732US2010209649A1Double-coated pressure sensitive adhesive sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →