Inventor · disambiguated record
Rickie C. Lake
Also filed as: LAKE RICKIE · LAKE RICKIE C · LAKE RICKIE CHARLES
134 granted patents·6 pending applications·6,717 citations·filing 1993–2015
99Inventor score
Files withMICRON TECHNOLOGY INC70MICRON COMMUNICATIONS INC41INTEL CORP8LAKE RICKIE C5ROUND ROCK RES LLC5
Top patents by PatentIndex Score
140 records- 0199US5448110AEnclosed transceiverMICRON COMMUNICATIONS INC·Filed 1993·Granted Sep 5, 1995·585 cites·9 claims
- 0298US6375780B1Method of manufacturing an enclosed transceiverMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 23, 2002·239 cites·9 claims
- 0398US6325294B2Method of manufacturing an enclosed transceiverMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 4, 2001·153 cites·24 claims
- 0498US6167614B1Method of manufacturing and testing an electronic device, and an electronic deviceMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 2, 2001·411 cites·21 claims
- 0598US6078791ARadio frequency identification transceiver and antennaMICRON COMMUNICATIONS INC·Filed 1997·Granted Jun 20, 2000·270 cites·10 claims
- 0698US5350645APolymer-lithium batteries and improved methods for manufacturing batteriesMICRON SEMICONDUCTOR INC·Filed 1993·Granted Sep 27, 1994·204 cites·25 claims
- 0797US8183151B2Methods of forming conductive vias through substrates, and structures and assemblies resulting therefromLAKE RICKIE C·Filed 2007·Granted May 22, 2012·92 cites·20 claims
- 0897US6045652AMethod of manufacturing an enclosed transceiverMICRON COMMUNICATIONS INC·Filed 1998·Granted Apr 4, 2000·239 cites·14 claims
- 0997US5983363AIn-sheet transceiver testingMICRON COMMUNICATIONS INC·Filed 1994·Granted Nov 9, 1999·113 cites·5 claims
- 1097US5779839AMethod of manufacturing an enclosed transceiverMICRON COMMUNICATIONS INC·Filed 1997·Granted Jul 14, 1998·262 cites·10 claims
- 1197US5326652ABattery package and method using flexible polymer films having a deposited layer of an inorganic materialMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jul 5, 1994·173 cites·20 claims
- 1296US6515591B2Termite sensing methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 4, 2003·69 cites·8 claims
- 1396US6255959B1Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methodsMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 3, 2001·84 cites·34 claims
- 1496US5907477ASubstrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulantMICRON COMMUNICATIONS INC·Filed 1997·Granted May 25, 1999·290 cites·11 claims
- 1596US5776278AMethod of manufacturing an enclosed transceiverMICRON COMMUNICATIONS INC·Filed 1997·Granted Jul 7, 1998·162 cites·9 claims
- 1695US6487681B1In-sheet transceiver testingMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 26, 2002·83 cites·20 claims
- 1795US6161281ABattery mounting apparatuses, electronic devices, and methods of forming electrical connectionsMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 19, 2000·112 cites·5 claims
- 1895US6100805ADevices for sensing termites and other living organisms, and methods of forming devices for sensing termitesMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 8, 2000·82 cites·16 claims
- 1995US5663598AElectrical circuit bonding interconnect component and flip chip interconnect bondMICRON COMMUNICATIONS INC·Filed 1995·Granted Sep 2, 1997·88 cites·14 claims
- 2094US6220516B1Method of manufacturing an enclosed transceiverMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 24, 2001·133 cites·30 claims
- 2194US5972152AMethods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrierMICRON COMMUNICATIONS INC·Filed 1997·Granted Oct 26, 1999·193 cites·38 claims
- 2293US7687916B2Semiconductor substrates including vias of nonuniform cross-section and associated structuresMICRON TECHNOLOGY INC·Filed 2008·Granted Mar 30, 2010·16 cites·33 claims
- 2393US7425507B2Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 16, 2008·19 cites·35 claims
- 2493USRE40137EMethods for forming integrated circuits within substratesMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 4, 2008·57 cites·58 claims
- 2592US7511616B2Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuitKEYSTONE TECHNOLOGY SOLUTIONS·Filed 2004·Granted Mar 31, 2009·40 cites·17 claims
- 2692US6062722AFluid mixing and withdrawing methodsMICRON COMMUNICATIONS INC·Filed 1997·Granted May 16, 2000·115 cites·2 claims
- 2791US6271801B2Embedded circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 7, 2001·87 cites·11 claims
- 2889US6630887B2Electrical apparatuses, and methods of forming electrical apparatusesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 7, 2003·40 cites·17 claims
- 2989US6458234B1Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrateMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 1, 2002·65 cites·16 claims
- 3089US6392545B2Electrical apparatuses, and methods of forming electrical apparatusesMICRON TECHNOLOGY INC·Filed 2000·Granted May 21, 2002·35 cites·30 claims
- 3189US6329213B1Methods for forming integrated circuits within substratesMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 11, 2001·77 cites·18 claims
- 3289US6177859B1Radio frequency communication apparatus and methods of forming a radio frequency communication apparatusMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 23, 2001·120 cites·37 claims
- 3389US6031459AWireless communication devices, radio frequency identification devices, and methods of forming wireless communication devices and radio frequency identification devicesMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 29, 2000·116 cites·61 claims
- 3489US5612513AArticle and method of manufacturing an enclosed electrical circuit using an encapsulantMICRON COMMUNICATIONS INC·Filed 1995·Granted Mar 18, 1997·99 cites·34 claims
- 3587US5937512AMethod of forming a circuit boardMICRON COMMUNICATIONS INC·Filed 1996·Granted Aug 17, 1999·82 cites·40 claims
- 3686US6166915AElectronic circuits and circuit boardsMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 26, 2000·76 cites·12 claims
- 3785US6016746AFlip chip screen printing methodMICRON COMMUNICATIONS INC·Filed 1997·Granted Jan 25, 2000·43 cites·1 claims
- 3885US5480834AProcess of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agentMICRON COMMUNICATIONS INC·Filed 1993·Granted Jan 2, 1996·42 cites·3 claims
- 3984US6304185B1Devices for sensing living organisms, devices for sensing termites, methods of forming devices for sensing termites, and methods for sensing termitesMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 16, 2001·52 cites·55 claims
- 4084USRE36843EPolymer-lithium batteries and improved methods for manufacturing batteriesMICRON TECHNOLOGY INC·Filed 1996·Granted Aug 29, 2000·65 cites·26 claims
- 4184US6025089ABattery comprising inkMICRON COMMUNICATIONS INC·Filed 1998·Granted Feb 15, 2000·39 cites·8 claims
- 4284US5963177AMethods of enhancing electronmagnetic radiation properties of encapsulated circuit, and related devicesMICRON COMMUNICATIONS INC·Filed 1997·Granted Oct 5, 1999·81 cites·49 claims
- 4383US6281799B1Devices for sensing changes in environments proximate the devices, devices for sensing termites, and methods for sensing termitesMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 28, 2001·52 cites·39 claims
- 4482USRE35746EBattery package and method using flexible polymer films having a deposited layer of an inorganic materialMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 17, 1998·56 cites·21 claims
- 4581US9998643B2Methods of forming curved image sensorsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Jun 12, 2018·3 cites·11 claims
- 4681US7199449B2Wafer backside removal to complete through-holes and provide wafer singulation during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 3, 2007·30 cites·16 claims
- 4781US6821032B2Methods of sealing electronic, optical and electro-optical packages and related package and substrate designsINTEL CORP·Filed 2002·Granted Nov 23, 2004·28 cites·29 claims
- 4881US6313748B1Electrical apparatuses, termite sensing apparatuses, methods of forming electrical apparatuses, and methods of sensing termitesMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 6, 2001·41 cites·16 claims
- 4981US6083773AMethods of forming flip chip bumps and related flip chip bump constructionsMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 4, 2000·46 cites·47 claims
- 5081US6030721ABatteries comprising an ink layerMICRON COMMUNICATIONS INC·Filed 1998·Granted Feb 29, 2000·36 cites·17 claims
Showing the top 50 of 140 patent records by PatentIndex Score.
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