Inventor · disambiguated record
Richard J. Lebel
Also filed as: LEBEL RICHARD J · LEBEL RICHARD JOHN
13 granted patents·408 citations·filing 1993–2005
93Inventor score
Files withIBM13
Top patents by PatentIndex Score
13 records- 0193US6334807B1Chemical mechanical polishing in-situ end point systemIBM·Filed 1999·Granted Jan 1, 2002·113 cites·27 claims
- 0286US6022266AIn-situ pad conditioning process for CMPIBM·Filed 1998·Granted Feb 8, 2000·76 cites·21 claims
- 0384US6319093B1Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurementIBM·Filed 2001·Granted Nov 20, 2001·32 cites·26 claims
- 0484US5738568AFlexible tilted wafer carrierIBM·Filed 1996·Granted Apr 14, 1998·81 cites·23 claims
- 0572US5381234AMethod and apparatus for real-time film surface detection for large area wafersIBM·Filed 1993·Granted Jan 10, 1995·36 cites·23 claims
- 0670US6579149B2Support and alignment device for enabling chemical mechanical polishing rinse and film measurementsIBM·Filed 2001·Granted Jun 17, 2003·13 cites·20 claims
- 0768US7130038B2Method and apparatus for optical film measurements in a controlled environmentIBM·Filed 2005·Granted Oct 31, 2006·1 cites·18 claims
- 0866US6967715B2Method and apparatus for optical film measurements in a controlled environmentIBM·Filed 2002·Granted Nov 22, 2005·10 cites·19 claims
- 0961US5885135ACMP wafer carrier for preferential polishing of a waferIBM·Filed 1997·Granted Mar 23, 1999·32 cites·17 claims
- 1056US6567172B1System and multipass probe for optical interference measurementsIBM·Filed 2000·Granted May 20, 2003·7 cites·25 claims
- 1136US6738142B2Integrated wafer cassette metrology assemblyIBM·Filed 2001·Granted May 18, 2004·0 cites·19 claims
- 1233US5849629AMethod of forming a low stress polycide conductors on a semiconductor chipIBM·Filed 1995·Granted Dec 15, 1998·5 cites·8 claims
- 1328US6247368B1CMP wet application wafer sensorIBM·Filed 1999·Granted Jun 19, 2001·2 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →