Inventor · disambiguated record
Richard Scott List
Also filed as: LIST RICHARD S · LIST RICHARD SCOTT
17 granted patents·574 citations·filing 1996–2008
95Inventor score
Top patents by PatentIndex Score
17 records- 0194US6737728B1On-chip decoupling capacitor and method of making sameINTEL CORP·Filed 2000·Granted May 18, 2004·75 cites·12 claims
- 0294US6204200B1Process scheme to form controlled airgaps between interconnect lines to reduce capacitanceTEXAS INSTRUMENTS INC·Filed 1998·Granted Mar 20, 2001·304 cites·17 claims
- 0376US7960226B2Method of forming on-chip decoupling capacitor with bottom electrode layer having surface roughnessINTEL CORP·Filed 2005·Granted Jun 14, 2011·4 cites·20 claims
- 0476US7843036B2Enhanced on-chip decoupling capacitors and method of making sameINTEL CORP·Filed 2008·Granted Nov 30, 2010·4 cites·6 claims
- 0576US6706584B2On-die de-coupling capacitor using bumps or bars and method of making sameINTEL CORP·Filed 2001·Granted Mar 16, 2004·19 cites·12 claims
- 0675US6888716B2On-die de-coupling capacitor using bumps or barsINTEL CORP·Filed 2004·Granted May 3, 2005·17 cites·26 claims
- 0775US6737699B2Enhanced on-chip decoupling capacitors and method of making sameINTEL CORP·Filed 2002·Granted May 18, 2004·14 cites·6 claims
- 0874US7416954B2Enhanced on-chip decoupling capacitors and method of making sameINTEL CORP·Filed 2004·Granted Aug 26, 2008·13 cites·5 claims
- 0973US7893481B2Top electrode barrier for on-chip die de-coupling capacitor and method of making sameINTEL CORP·Filed 2007·Granted Feb 22, 2011·3 cites·20 claims
- 1070US7033882B2Method of forming on-chip decoupling capacitor by selectively etching grain boundaries in electrodeINTEL CORP·Filed 2004·Granted Apr 25, 2006·10 cites·13 claims
- 1164US6800928B1Porous integrated circuit dielectric with decreased surface porosityTEXAS INSTRUMENTS INC·Filed 1998·Granted Oct 5, 2004·27 cites·2 claims
- 1256US5850657AWoodworking tool for preparing a wood surface for finishingHYDE TOOLS·Filed 1997·Granted Dec 22, 1998·28 cites·23 claims
- 1355US7138678B2Enhanced on-chip decoupling capacitors and method of making sameINTEL CORP·Filed 2004·Granted Nov 21, 2006·4 cites·4 claims
- 1453US6127203AThermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansionDRS TECHNOLOGIES INC·Filed 1999·Granted Oct 3, 2000·21 cites·11 claims
- 1552US7256089B2Top electrode barrier for on-chip die de-coupling capacitor and method of making sameINTEL CORP·Filed 2001·Granted Aug 14, 2007·3 cites·7 claims
- 1652US5959340AThermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansionDRS TECHNOLOGIES INC·Filed 1996·Granted Sep 28, 1999·20 cites·15 claims
- 1742US6784121B1Integrated circuit dielectric and methodTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 31, 2004·8 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →