Inventor · disambiguated record
Richard H. Livengood
Also filed as: LIVENGOOD RICHARD · LIVENGOOD RICHARD H
32 granted patents·6 pending applications·1,074 citations·filing 1996–2023
98Inventor score
Files withINTEL CORP38
Top patents by PatentIndex Score
38 records- 0199US6448168B1Method for distributing a clock on the silicon backside of an integrated circuitINTEL CORP·Filed 2000·Granted Sep 10, 2002·382 cites·13 claims
- 0295US6222246B1Flip-chip having an on-chip decoupling capacitorINTEL CORP·Filed 1999·Granted Apr 24, 2001·106 cites·17 claims
- 0390US6825557B2Localized backside chip cooling with integrated smart valvesINTEL CORP·Filed 2002·Granted Nov 30, 2004·62 cites·30 claims
- 0490US6495454B2Substrate interconnect for power distribution on integrated circuitsINTEL CORP·Filed 2001·Granted Dec 17, 2002·66 cites·7 claims
- 0586US6355494B1Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointingINTEL CORP·Filed 2000·Granted Mar 12, 2002·27 cites·20 claims
- 0686US6037822AMethod and apparatus for distributing a clock on the silicon backside of an integrated circuitINTEL CORP·Filed 1997·Granted Mar 14, 2000·71 cites·9 claims
- 0782US6316981B1Signal distribution network on backside of substrateINTEL CORP·Filed 2000·Granted Nov 13, 2001·23 cites·7 claims
- 0876US6355950B1Substrate interconnect for power distribution on integrated circuitsINTEL CORP·Filed 1998·Granted Mar 12, 2002·47 cites·27 claims
- 0975US5948217AMethod and apparatus for endpointing while milling an integrated circuitINTEL CORP·Filed 1996·Granted Sep 7, 1999·45 cites·33 claims
- 1075US5942805AFiducial for aligning an integrated circuit dieINTEL CORP·Filed 1996·Granted Aug 24, 1999·40 cites·8 claims
- 1173US5952247AMethod of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrateINTEL CORP·Filed 1996·Granted Sep 14, 1999·34 cites·63 claims
- 1271US5805421ASemiconductor substrate having alignment marks for locating circuitry on the substrateINTEL CORP·Filed 1997·Granted Sep 8, 1998·30 cites·20 claims
- 1367US7205566B2Transistor-level signal cutting method and structureINTEL CORP·Filed 2005·Granted Apr 17, 2007·2 cites·15 claims
- 1462US6309897B1Method and apparatus providing a circuit edit structure through the back side of an integrated circuit dieINTEL CORP·Filed 2000·Granted Oct 30, 2001·10 cites·7 claims
- 1561US6579732B2Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointingINTEL CORP·Filed 2001·Granted Jun 17, 2003·5 cites·26 claims
- 1660US6525922B2High performance via capacitor and method for manufacturing sameINTEL CORP·Filed 2000·Granted Feb 25, 2003·9 cites·25 claims
- 1758US7232526B2Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointingINTEL CORP·Filed 2004·Granted Jun 19, 2007·4 cites·26 claims
- 1857US6020746AMethod and apparatus for probing an integrated circuit through the back side of an integrated circuit dieINTEL CORP·Filed 1997·Granted Feb 1, 2000·21 cites·27 claims
- 1956US5976980AMethod and apparatus providing a mechanical probe structure in an integrated circuit dieINTEL CORP·Filed 1997·Granted Nov 2, 1999·20 cites·23 claims
- 2055US5904486AMethod for performing a circuit edit through the back side of an integrated circuit dieINTEL CORP·Filed 1997·Granted May 18, 1999·17 cites·22 claims
- 2154US6153891AMethod and apparatus providing a circuit edit structure through the back side of an integrated circuit dieINTEL CORP·Filed 1997·Granted Nov 28, 2000·10 cites·13 claims
- 2253US2024105419A1Altering operational characteristics of a semiconductor device using accelerated ionsINTEL CORP·Filed 2022·Application pending·0 cites
- 2350US2025201707A1Skeleton etch for semiconductor chipsINTEL CORP·Filed 2023·Application pending·0 cites
- 2450US2023369207A1Inline circuit editINTEL CORP·Filed 2022·Application pending·0 cites
- 2549US7141439B2Transistor-level signal cutting method and structureINTEL CORP·Filed 2005·Granted Nov 28, 2006·0 cites·25 claims
- 2649US2023369221A1Inline circuit edit for backside power delivery with deep viaINTEL CORP·Filed 2022·Application pending·0 cites
- 2749US2023369211A1Designs to enable inline circuit editINTEL CORP·Filed 2022·Application pending·0 cites
- 2848US6528895B2Method and apparatus for making and using an improved fiducial for an integrated circuitINTEL CORP·Filed 2001·Granted Mar 4, 2003·1 cites·10 claims
- 2948US6150718AMethod and apparatus for performing a circuit edit through the back side of an integrated circuit dieINTEL CORP·Filed 1999·Granted Nov 21, 2000·12 cites·3 claims
- 3048US6001703AMethod of forming a fiducial for aligning an integrated circuit dieINTEL CORP·Filed 1997·Granted Dec 14, 1999·12 cites·7 claims
- 3143US6855946B2Fiducial transistor in an integrated circuitINTEL CORP·Filed 2003·Granted Feb 15, 2005·1 cites·22 claims
- 3243US6780658B2Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointingINTEL CORP·Filed 2003·Granted Aug 24, 2004·0 cites·37 claims
- 3343US2024006302A1Gate-all-around transistor circuit modification using direct contact and/or access probe pointsINTEL CORP·Filed 2022·Application pending·0 cites
- 3442US6159753AMethod and apparatus for editing an integrated circuitINTEL CORP·Filed 1996·Granted Dec 12, 2000·9 cites·16 claims
- 3540US6122174AMethod of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrateINTEL CORP·Filed 1999·Granted Sep 19, 2000·6 cites·19 claims
- 3633US7183122B2Physical nano-machining with a scanning probe system for integrated circuit modificationINTEL CORP·Filed 2004·Granted Feb 27, 2007·0 cites·18 claims
- 3732US6373572B1Method and apparatus for making and using an improved fiducial for an intergrated circuitINTEL CORP·Filed 1999·Granted Apr 16, 2002·1 cites·10 claims
- 3829US6753541B1Method and apparatus for making and using a beacon fiducial for an integrated circuitINTEL CORP·Filed 1999·Granted Jun 22, 2004·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →