Inventor · disambiguated record
Rikihiro Maruyama
Also filed as: MARUYAMA RIKIHIRO
28 granted patents·6 pending applications·86 citations·filing 1994–2025
94Inventor score
Technology areasH10W
Top patents by PatentIndex Score
34 records- 0190USD364385SSemi-conductor element with terminal casingFUJI ELECTRIC CO LTD·Filed 1994·Granted Nov 21, 1995·41 cites·1 claims
- 0279US7944042B2Semiconductor device and method of manufacturing sameFUJI ELEC DEVICE TECH CO LTD·Filed 2008·Granted May 17, 2011·12 cites·10 claims
- 0378US10784176B1Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2020·Granted Sep 22, 2020·1 cites·20 claims
- 0475US10978371B2Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 0575US10398036B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Aug 27, 2019·2 cites·15 claims
- 0671US9204559B2Manufacturing method of semiconductor device and mounting jigFUJI ELECTRIC CO LTD·Filed 2014·Granted Dec 1, 2015·3 cites·9 claims
- 0767US9673117B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2016·Granted Jun 6, 2017·2 cites·5 claims
- 0864US10405434B2Mounting jig for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Sep 3, 2019·1 cites·7 claims
- 0964US2025253257A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1063US10199314B2Semiconductor device, metal member, and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·1 cites·19 claims
- 1163US7902653B2Semiconductor moduleFUJI ELECTRIC SYSTEMS CO LTD·Filed 2008·Granted Mar 8, 2011·2 cites·7 claims
- 1262US9877397B2Mounting jig for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Jan 23, 2018·1 cites·8 claims
- 1359US2024347431A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1458US9876293B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Jan 23, 2018·1 cites·19 claims
- 1556US11337306B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 1656US11164846B2Semiconductor device manufacturing method and soldering support jigFUJI ELECTRIC CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·13 claims
- 1754US11721633B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·16 claims
- 1854US10566308B2Semiconductor device manufacturing method and soldering support jigFUJI ELECTRIC CO LTD·Filed 2018·Granted Feb 18, 2020·0 cites·7 claims
- 1952US11626358B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 2052US2025249629A1Method of manufacturing semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2151US9070696B2Semiconductor device manufacturing method and semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Jun 30, 2015·0 cites·6 claims
- 2251US2023343682A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 2350US11295997B2Semiconductor device manufacturing method and semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·16 claims
- 2450US11107784B2Semiconductor device having circuit board to which contact part is bondedFUJI ELECTRIC CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·14 claims
- 2550US6262474B1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 1999·Granted Jul 17, 2001·17 cites·8 claims
- 2650US2025391727A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2748US2013306296A1Semiconductor module radiator plate fabrication method, radiator plate, and semiconductor module using the sameFUJI ELECTRIC CO LTD·Filed 2013·Application pending·0 cites
- 2847US10262874B2Semiconductor module radiator plate fabrication method, radiator plate, and semiconductor module using the sameFUJI ELECTRIC CO LTD·Filed 2016·Granted Apr 16, 2019·0 cites·6 claims
- 2946US9466509B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2015·Granted Oct 11, 2016·0 cites·7 claims
- 3046US7985630B2Method for manufacturing semiconductor moduleFUJI ELEC DEVICE TECH CO LTD·Filed 2010·Granted Jul 26, 2011·0 cites·6 claims
- 3142US11069643B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2019·Granted Jul 20, 2021·0 cites·12 claims
- 3242US10424522B2Case, semiconductor device and manufacturing method of caseFUJI ELECTRIC CO LTD·Filed 2018·Granted Sep 24, 2019·0 cites·17 claims
- 3341US10699994B2Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are solderedFUJI ELECTRIC CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·18 claims
- 3438US9691697B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Jun 27, 2017·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →