Inventor · disambiguated record
Risa Miyazawa
Also filed as: MIYAZAWA RISA
9 granted patents·2 pending applications·11 citations·filing 2018–2025
79Inventor score
Files withIBM11
Top patents by PatentIndex Score
11 records- 0191US11574817B2Fabricating an interconnection using a sacrificial layerIBM·Filed 2021·Granted Feb 7, 2023·2 cites·14 claims
- 0289US11264314B2Interconnection with side connection to substrateIBM·Filed 2019·Granted Mar 1, 2022·6 cites·9 claims
- 0384US11004819B2Prevention of bridging between solder jointsIBM·Filed 2019·Granted May 11, 2021·3 cites·14 claims
- 0468US2025259905A1Underfill vacuum processIBM·Filed 2025·Application pending·0 cites
- 0567US11456269B2Prevention of bridging between solder jointsIBM·Filed 2021·Granted Sep 27, 2022·0 cites·8 claims
- 0666US12315775B2Underfill vacuum processIBM·Filed 2021·Granted May 27, 2025·0 cites·8 claims
- 0760US11908723B2Silicon handler with laser-release layersIBM·Filed 2021·Granted Feb 20, 2024·0 cites·24 claims
- 0854US11164845B2Resist structure for forming bumpsIBM·Filed 2020·Granted Nov 2, 2021·0 cites·24 claims
- 0954US10903526B2Electron device stack structureIBM·Filed 2018·Granted Jan 26, 2021·0 cites·8 claims
- 1053US11735529B2Side pad anchored by next adjacent viaIBM·Filed 2021·Granted Aug 22, 2023·0 cites·19 claims
- 1153US2024006371A1Semiconductor device interconnect structureIBM·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →