Inventor · disambiguated record
Rie Mizutani
Also filed as: MIZUTANI RIE
6 granted patents·1 pending application·0 citations·filing 2019–2025
63Inventor score
Files withSHINKO ELECTRIC IND CO7
Top patents by PatentIndex Score
7 records- 0166US2025386431A1Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2025·Application pending·0 cites
- 0256US11792927B2Interconnect substrateSHINKO ELECTRIC IND CO·Filed 2022·Granted Oct 17, 2023·0 cites·8 claims
- 0354US11716810B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Aug 1, 2023·0 cites·7 claims
- 0452US12341088B2Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structureSHINKO ELECTRIC IND CO·Filed 2022·Granted Jun 24, 2025·0 cites·9 claims
- 0551US11729914B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Aug 15, 2023·0 cites·12 claims
- 0651US10743403B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2019·Granted Aug 11, 2020·0 cites·13 claims
- 0743US10804210B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2019·Granted Oct 13, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →