Inventor · disambiguated record
Rieka Ohuchi
Also filed as: OHUCHI RIEKA
9 granted patents·128 citations·filing 1998–2005
88Inventor score
Top patents by PatentIndex Score
9 records- 0181US6311888B1Resin film and a method for connecting electronic parts by the use thereofNEC CORP·Filed 2000·Granted Nov 6, 2001·31 cites·6 claims
- 0273US6214446B1Resin film and a method for connecting electronic parts by the use thereofNEC CORP·Filed 1999·Granted Apr 10, 2001·39 cites·13 claims
- 0371US6538335B2Semiconductor apparatus and a semiconductor device mounting methodNEC CORP·Filed 2002·Granted Mar 25, 2003·17 cites·26 claims
- 0468US6975036B2Flip-chip semiconductor device utilizing an elongated tip bumpNEC ELECTRONICS CORP·Filed 2003·Granted Dec 13, 2005·19 cites·7 claims
- 0560US7579211B2Flip-chip semiconductor device utilizing an elongated tip bumpNEC ELECTRONICS CORP·Filed 2005·Granted Aug 25, 2009·4 cites·18 claims
- 0657US6841420B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2003·Granted Jan 11, 2005·7 cites·12 claims
- 0745US6919646B2Semiconductor device with contacting electrodesNEC ELECTRONICS CORP·Filed 2003·Granted Jul 19, 2005·2 cites·6 claims
- 0842US6197617B1Semiconductor device with high reliability of connection between projective electrode of semiconductor element and conductive wire of substrate and method of manufacturing the sameNEC CORP·Filed 1998·Granted Mar 6, 2001·9 cites·11 claims
- 0938US6344372B1Semiconductor device with reliable connection between projective electrode and conductive wire of the substrateNEC CORP·Filed 2000·Granted Feb 5, 2002·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →