Inventor · disambiguated record
Rikiya Okimoto
Also filed as: OKIMOTO RIKIYA
0 granted patents·11 pending applications·0 citations·filing 2004–2023
Top patents by PatentIndex Score
11 records- 0166US2025141051A1Secondary battery and method for producing secondary batteryPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 0253US2008185178A1Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 0351US2023128084A1Electrode for batteries, and batteryPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 0448US2008186045A1Test mark structure, substrate sheet laminate, multilayered circuit substrate, method for inspecting lamination matching precision of multilayered circuit substrate, and method for designing substrate sheet laminateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 0547US2009202142A1Circuit board, method for testing circuit board, and method for manufacturing circuit boardISHIMARU YUKIHIRO·Filed 2007·Application pending·0 cites
- 0646US2024227005A9Green compact conveying mechanism and green compact forming devicePANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 0746US2008296053A1Electronic component module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 0844US2005124197A1Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 0943US2008298023A1Electronic component-containing module and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 1043US2009115067A1Module having built-in electronic component and method for manufacturing such moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1142US2009032285A1Multi-layer circuit substrate manufacturing method and multi-layer circuit substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →