Inventor · disambiguated record
Richard Patten
Also filed as: PATTEN RICHARD · PATTEN RICHARD L
28 granted patents·8 pending applications·312 citations·filing 1990–2025
96Inventor score
Top patents by PatentIndex Score
36 records- 0197US11955462B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0294US10910347B2Method, apparatus and system to interconnect packaged integrated circuit diesINTEL CORP·Filed 2019·Granted Feb 2, 2021·10 cites·22 claims
- 0394US10872881B2Microelectronic packages with high integration microelectronic dice stackINTEL IP CORP·Filed 2020·Granted Dec 22, 2020·3 cites·20 claims
- 0488US10249598B2Integrated circuit package having wirebonded multi-die stackINTEL CORP·Filed 2018·Granted Apr 2, 2019·4 cites·10 claims
- 0583US10622333B2Microelectronic packages with high integration microelectronic dice stackINTEL IP CORP·Filed 2015·Granted Apr 14, 2020·3 cites·22 claims
- 0683US9859255B1Electronic device packageINTEL CORP·Filed 2016·Granted Jan 2, 2018·6 cites·23 claims
- 0783US5147204ADental material curing apparatusMINNESOTA MINING & MFG·Filed 1991·Granted Sep 15, 1992·98 cites·14 claims
- 0882US9972601B2Integrated circuit package having wirebonded multi-die stackINTEL CORP·Filed 2014·Granted May 15, 2018·4 cites·16 claims
- 0982USD368752SMallet-type golf putter headPATTEN RICHARD L·Filed 1994·Granted Apr 9, 1996·23 cites·1 claims
- 1081US10209466B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2016·Granted Feb 19, 2019·3 cites·17 claims
- 1181US2024213225A1Package stacking using chip to wafer bondingINTEL CORP·Filed 2024·Application pending·0 cites
- 1279US11735570B2Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2018·Granted Aug 22, 2023·2 cites·9 claims
- 1379US9248352B1Visual adjustable alignment systemPATTEN RICHARD L·Filed 2015·Granted Feb 2, 2016·6 cites·8 claims
- 1479USD408878SBlade-type golf putter headPATTEN RICHARD L·Filed 1997·Granted Apr 27, 1999·23 cites·1 claims
- 1578US12237305B2Integrated circuit package having wirebonded multi-die stackINTEL CORP·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1678US11239199B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2015·Granted Feb 1, 2022·2 cites·18 claims
- 1777US12243856B2Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1877USD366081SBlade-type golf putter headPATTEN RICHARD L·Filed 1994·Granted Jan 9, 1996·19 cites·1 claims
- 1977US2025167180A1Integrated circuit package having wirebonded multi-die stackINTEL CORP·Filed 2025·Application pending·0 cites
- 2075US10396055B2Method, apparatus and system to interconnect packaged integrated circuit diesINTEL CORP·Filed 2015·Granted Aug 27, 2019·2 cites·24 claims
- 2175US5377541AGolf club grip training assemblyFiled 1992·Granted Jan 3, 1995·49 cites·11 claims
- 2272US2025167183A1Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2025·Application pending·0 cites
- 2370US11527507B2Microelectronic packages with high integration microelectronic dice stackINTEL CORP·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 2469US10672731B2Wafer level package structure with internal conductive layerINTEL IP CORP·Filed 2015·Granted Jun 2, 2020·1 cites·18 claims
- 2565US11424209B2Wafer level package structure with internal conductive layerINTEL CORP·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 2665US5764060AGuidance system for a moving personMINNESOTA MINING & MFG·Filed 1996·Granted Jun 9, 1998·31 cites·15 claims
- 2758US10816742B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2018·Granted Oct 27, 2020·0 cites·8 claims
- 2858USD326474SCombined hand-held tape dispenser and applicatorMINNESOTA MINING & MFG·Filed 1990·Granted May 26, 1992·9 cites·1 claims
- 2958US2018315737A1Integrated circuit package having wirebonded multi-die stackINTEL CORP·Filed 2018·Application pending·0 cites
- 3047US10411000B2Microelectronic package with illuminated backside exteriorINTEL IP CORP·Filed 2016·Granted Sep 10, 2019·0 cites·20 claims
- 3147US2004242342A1Golf putter with error variance reducing insertFiled 2004·Application pending·0 cites
- 3244US10854590B2Semiconductor die package with more than one hanging dieINTEL IP CORP·Filed 2015·Granted Dec 1, 2020·0 cites·23 claims
- 3340US5917326AGuidance system for a moving personMINNESOTA MINING & MFG·Filed 1997·Granted Jun 29, 1999·11 cites·15 claims
- 3440US2020098698A1Novel wafer level chip scale package (wlcsp), flip-chip chip scale package (fccsp), and fan out shielding conceptsINTEL CORP·Filed 2018·Application pending·0 cites
- 3535US2017178999A1Flip-chip package with thermal dissipation layerINTEL IP CORP·Filed 2015·Application pending·0 cites
- 3635US2019121041A1Optical fiber connection on package edgeINTEL IP CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →