Inventor · disambiguated record
Richard J. Pommer
Also filed as: POMMER RICHARD · POMMER RICHARD J · POMMER RICHARD JOHN
30 granted patents·8 pending applications·975 citations·filing 1989–2018
97Inventor score
Files withHONEYWELL INT INC13ULTRA COMMUNICATIONS INC6ALLIED SIGNAL INC3AHADIAN JOSEPH F2KUZNIA CHARLES B2
Top patents by PatentIndex Score
38 records- 0195US6910812B2Small-scale optoelectronic packagePEREGRINE SEMICONDUCTOR CORP·Filed 2002·Granted Jun 28, 2005·226 cites·38 claims
- 0294US8335411B2Fiber optic bi-directional coupling lensKUZNIA CHARLES B·Filed 2009·Granted Dec 18, 2012·51 cites·9 claims
- 0393US8724944B2Fiber optic bi-directional coupling lensKUZNIA CHARLES B·Filed 2012·Granted May 13, 2014·25 cites·13 claims
- 0491US9465176B2Small form factor transceiver compatible with solder processingULTRA COMMUNICATIONS INC·Filed 2013·Granted Oct 11, 2016·13 cites·20 claims
- 0590US5633785AIntegrated circuit component package with integral passive componentUNIV SOUTHERN CALIFORNIA·Filed 1994·Granted May 27, 1997·124 cites·24 claims
- 0689US4922376ASpring grid array interconnection for active microelectronic elementsUNISTRUCTURE INC·Filed 1989·Granted May 1, 1990·160 cites·9 claims
- 0788US9442255B2Low profile fiber-to-module interface with relaxed alignment tolerancesPOMMER RICHARD J·Filed 2011·Granted Sep 13, 2016·20 cites·24 claims
- 0888US9151916B2Compact optical package made with planar structuresPOMMER RICHARD J·Filed 2012·Granted Oct 6, 2015·12 cites·19 claims
- 0987US10162124B2Fiber optic end-face transparent protector system and methodULTRA COMMUNICATIONS INC·Filed 2017·Granted Dec 25, 2018·4 cites·26 claims
- 1087US9784924B2Fiber optic end-face transparent protectorULTRA COMMUNICATIONS INC·Filed 2015·Granted Oct 10, 2017·5 cites·15 claims
- 1186US6245696B1Lasable bond-ply materials for high density printed wiring boardsHONEYWELL INT INC·Filed 1999·Granted Jun 12, 2001·59 cites·11 claims
- 1284US9429496B2Optical time domain reflectometer in a small form factor packageULTRA COMMUNICATIONS INC·Filed 2013·Granted Aug 30, 2016·6 cites·22 claims
- 1384US8348522B2Attachable components for providing an optical interconnect between/through printed wiring boardsULTRA COMMUNICATIONS INC·Filed 2009·Granted Jan 8, 2013·11 cites·21 claims
- 1481US6673190B2Lasable bond-ply materials for high density printed wiring boardsHONEYWELL INT INC·Filed 2001·Granted Jan 6, 2004·27 cites·9 claims
- 1581US5839188AMethod of manufacturing a printed circuit assemblyALLIED SIGNAL INC·Filed 1996·Granted Nov 24, 1998·57 cites·12 claims
- 1680US6242078B1High density printed circuit substrate and method of fabricationISOLA LAMINATE SYSTEMS CORP·Filed 1998·Granted Jun 5, 2001·55 cites·19 claims
- 1777US6570250B1Power conditioning substrate stiffenerHONEYWELL INT INC·Filed 2000·Granted May 27, 2003·21 cites·10 claims
- 1876US6246014B1Printed circuit assembly and method of manufacture thereforHONEYWELL INT INC·Filed 1998·Granted Jun 12, 2001·43 cites·12 claims
- 1975US6560844B1Alignment plate with matched thermal coefficient of expansionHONEYWELL INT INC·Filed 2000·Granted May 13, 2003·9 cites·8 claims
- 2066US6675456B2Alignment plate with matched thermal coefficient of expansion methodHONEYWELL INT INC·Filed 2002·Granted Jan 13, 2004·3 cites·5 claims
- 2161US10712508B2Fiber optic end-face transparent protector system and methodULTRA COMMUNICATIONS INC·Filed 2018·Granted Jul 14, 2020·0 cites·19 claims
- 2260US6147870APrinted circuit assembly having locally enhanced wiring densityHONEYWELL INT INC·Filed 1998·Granted Nov 14, 2000·21 cites·10 claims
- 2353US6489184B1Removing inherent stress via high temperature annealingHONEYWELL INT INC·Filed 2000·Granted Dec 3, 2002·3 cites·12 claims
- 2451US6319811B1Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inksFiled 2000·Granted Nov 20, 2001·4 cites·10 claims
- 2551US2004148756A1Alignment plate with matched thermal coefficient of expansionFiled 2003·Application pending·0 cites
- 2649US6261423B1Sputtering processHONEYWELL INT INC·Filed 2000·Granted Jul 17, 2001·3 cites·11 claims
- 2749US2004170795A1Lasable bond-ply materials for high density printed wiring boardsALLIED SIGNAL INC·Filed 2003·Application pending·0 cites
- 2849US2012176680A1Patterned backside optical coating on transparent substrateAHADIAN JOSEPH F·Filed 2010·Application pending·0 cites
- 2947US6576839B1Bond-ply structure for interconnection of circuit layer pairs with conductive inksHONEYWELL INT INC·Filed 2001·Granted Jun 10, 2003·2 cites·8 claims
- 3045US6338776B1Dielectric processing with included stabilization periodsHONEYWELL INT INC·Filed 2000·Granted Jan 15, 2002·1 cites·7 claims
- 3144US2009245736A1Connector attachment to a low height profile moduleAHADIAN JOSEPH F·Filed 2009·Application pending·0 cites
- 3243US6607939B2Method of making a multi-layer interconnectHONEYWELL INT INC·Filed 2001·Granted Aug 19, 2003·1 cites·4 claims
- 3340US6153060ASputtering processHONEYWELL INT INC·Filed 1999·Granted Nov 28, 2000·8 cites·11 claims
- 3439US2003197256A1Power conditioning substrate stiffenerFiled 2003·Application pending·0 cites
- 3534US2004124534A1Multi-layer interconnectFiled 2003·Application pending·0 cites
- 3630US2001039715A1Substrate manufacturing plant having minimum footprint skinned linesPOMMER·Filed 1999·Application pending·0 cites
- 3729US6388325B2Multi-layer interconnectALLIED SIGNAL INC·Filed 1999·Granted May 14, 2002·1 cites·14 claims
- 3825US2002000370A1Ion processing of a substrateFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →