Inventor · disambiguated record
Rizza Lee Saga Cizek
Also filed as: SAGA CIZEK RIZZA LEE
3 granted patents·14 citations·filing 2014–2016
63Inventor score
Files withINVENSAS CORP3
Top patents by PatentIndex Score
3 records- 0191US9412714B2Wire bond support structure and microelectronic package including wire bonds therefromINVENSAS CORP·Filed 2014·Granted Aug 9, 2016·11 cites·10 claims
- 0275US9082753B2Severing bond wire by kinking and twistingINVENSAS CORP·Filed 2014·Granted Jul 14, 2015·3 cites·19 claims
- 0350US9893033B2Off substrate kinking of bond wireINVENSAS CORP·Filed 2016·Granted Feb 13, 2018·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →