Inventor · disambiguated record
Richard Erich Schuster
Also filed as: SCHUSTER RICHARD E · SCHUSTER RICHARD ERICH
21 granted patents·1 pending application·292 citations·filing 1996–2022
94Inventor score
Files withCOMPONENT RE ENG COMPANY INC6COMPONENT RE ENGINEERING COMPANY INC5INSYNC SYSTEMS INC4WATLOW ELECTRIC MFG4COMPONENT RE ENGINEERING COMPNAY INC1
Top patents by PatentIndex Score
22 records- 0195US5836355ABuilding blocks for integrated gas panelINSYNC SYSTEMS INC·Filed 1996·Granted Nov 17, 1998·148 cites·25 claims
- 0289US11712745B2Semiconductor substrate support with multiple electrodes and method for making sameWATLOW ELECTRIC MFG·Filed 2022·Granted Aug 1, 2023·1 cites·14 claims
- 0389US6302141B1Building blocks for integrated gas panelINSYNC SYSTEMS INC·Filed 1997·Granted Oct 16, 2001·64 cites·99 claims
- 0488US7472372B1Fast image simulation for photolithographyFIEKOWSKY PETER J·Filed 2005·Granted Dec 30, 2008·10 cites·15 claims
- 0587US8684256B2Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processingCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 1, 2014·7 cites·10 claims
- 0686US9624137B2Low temperature method for hermetically joining non-diffusing ceramic materialsCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2014·Granted Apr 18, 2017·6 cites·26 claims
- 0786US8789743B2Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materialsCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Jul 29, 2014·5 cites·19 claims
- 0882US11091397B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesWATLOW ELECTRIC MFG·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 0977US8932690B2Plate and shaft deviceELLIOT ALFRED GRANT·Filed 2012·Granted Jan 13, 2015·4 cites·13 claims
- 1074US10646941B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 12, 2020·1 cites·16 claims
- 1170US9984866B2Multiple zone heaterCOMPONENT RE ENG COMPANY INC·Filed 2013·Granted May 29, 2018·2 cites·7 claims
- 1269US9556074B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2012·Granted Jan 31, 2017·1 cites·23 claims
- 1369US9315424B2Multi-layer plate deviceCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 19, 2016·1 cites·19 claims
- 1467US10153183B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2014·Granted Dec 11, 2018·1 cites·10 claims
- 1562US6158454ASieve like structure for fluid flow through structural arrangementINSYNC SYSTEMS INC·Filed 1998·Granted Dec 12, 2000·21 cites·58 claims
- 1661US10991616B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2018·Granted Apr 27, 2021·0 cites·7 claims
- 1757US11823890B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 1857US10213858B2Multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Feb 26, 2019·0 cites·15 claims
- 1955US10287215B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 14, 2019·0 cites·14 claims
- 2054US11495450B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 8, 2022·0 cites·16 claims
- 2153US6231260B1Mounting plane for integrated gas panelINSYNC SYSTEMS INC·Filed 1997·Granted May 15, 2001·18 cites·29 claims
- 2243US2014014710A1Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized RegionsCOMPONENT RE ENGINEERING COMPNAY INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →