Inventor · disambiguated record
Richard Shanaman
Also filed as: SHANAMAN III RICHARD H · SHANAMAN III RICHARD HANDLY · SHANAMAN RICHARD H III · SHANAMAN RICHARD III
4 granted patents·2 pending applications·36 citations·filing 1992–2004
75Inventor score
Top patents by PatentIndex Score
6 records- 0169US7214568B2Semiconductor device configured for reducing post-fabrication damageAGERE SYSTEMS INC·Filed 2004·Granted May 8, 2007·14 cites·23 claims
- 0250US7745927B2Heat sink formed of multiple metal layers on backside of integrated circuit dieAGERE SYSTEMS INC·Filed 2004·Granted Jun 29, 2010·5 cites·7 claims
- 0349US7075174B2Semiconductor packaging techniques for use with non-ceramic packagesAGERE SYSTEMS INC·Filed 2004·Granted Jul 11, 2006·4 cites·20 claims
- 0441US5366924AMethod of manufacturing an integrated circuit including planarizing a waferAT & T BELL LAB·Filed 1992·Granted Nov 22, 1994·13 cites·10 claims
- 0538US2006108672A1Die bonded device and method for transistor packagesBRENNAN JOHN M·Filed 2004·Application pending·0 cites
- 0632US2005184385A1Semiconductor device with improved thermal characteristicsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →