Inventor · disambiguated record
Rick Snyder
Also filed as: SNYDER RICK · SNYDER RICK B · SNYDER RICK D
7 granted patents·4 pending applications·14 citations·filing 2004–2020
75Inventor score
Files withAVAGO TECHNOLOGIES GENERAL IP2AEROSONIC LLC1AVAGO TECHNOLOGIES WIRELESS IP1GILBERT STEVE1LYPEN WILLIAM J1
Top patents by PatentIndex Score
11 records- 0180US8587391B2Acoustic coupling layer for coupled resonator filters and method of fabricating acoustic coupling layerGILBERT STEVE·Filed 2010·Granted Nov 19, 2013·9 cites·13 claims
- 0271US8946877B2Semiconductor package including capSNYDER RICK·Filed 2010·Granted Feb 3, 2015·5 cites·22 claims
- 0351US11422150B2Aircraft airflow sensor having error correction based on aircraft movement and process of correcting an aircraft airflow sensor output based on aircraft movementAEROSONIC LLC·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 0450US9508661B2Moisture barrier for semiconductor structures with stress reliefAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Granted Nov 29, 2016·0 cites·45 claims
- 0547US9576920B2Moisture barrier for semiconductor structures with stress reliefAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Feb 21, 2017·0 cites·28 claims
- 0639US7977799B2Planar packageless semiconductor structure with via and coplanar contactsAVAGO TECHNOLOGIES WIRELESS IP·Filed 2008·Granted Jul 12, 2011·0 cites·20 claims
- 0738US9087926B2Low capacitance semiconductor deviceSNYDER RICK D·Filed 2009·Granted Jul 21, 2015·0 cites·20 claims
- 0837US2011198273A1Multi-stage storm drain filter insertSTORMWATER MAINTENANCE COMPANY·Filed 2011·Application pending·0 cites
- 0936US2006255102A1Technique for defining a wettable solder joint area for an electronic assembly substrateSNYDER RICK B·Filed 2005·Application pending·0 cites
- 1035US2005163966A1Surface mounting of componentsFiled 2004·Application pending·0 cites
- 1120US2006076639A1Schottky diodes and methods of making the sameLYPEN WILLIAM J·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →