Inventor · disambiguated record
Rina Tanaka
Also filed as: TANAKA RINA
27 granted patents·9 pending applications·47 citations·filing 2013–2024
93Inventor score
Top patents by PatentIndex Score
36 records- 0191US9741797B2Insulated gate silicon carbide semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 22, 2017·10 cites·13 claims
- 0290US10510843B2Insulated gate silicon carbide semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Dec 17, 2019·5 cites·26 claims
- 0389US11271084B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 8, 2022·5 cites·19 claims
- 0486US10157986B2Silicon carbide semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Dec 18, 2018·5 cites·13 claims
- 0583US10229969B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Mar 12, 2019·4 cites·11 claims
- 0682US9825164B2Silicon carbide semiconductor device and manufacturing method for sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Nov 21, 2017·5 cites·8 claims
- 0782US9425261B2Silicon-carbide semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Aug 23, 2016·5 cites·12 claims
- 0879US2025120160A1Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0972US10468487B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Nov 5, 2019·2 cites·16 claims
- 1070US11894428B2Silicon carbide semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Feb 6, 2024·1 cites·16 claims
- 1168US12266706B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 1267US9496344B2Semiconductor device including well regions with different impurity densitiesTANAKA RINA·Filed 2013·Granted Nov 15, 2016·3 cites·9 claims
- 1363US9337271B2Silicon-carbide semiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2013·Granted May 10, 2016·1 cites·11 claims
- 1462US9698221B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 4, 2017·1 cites·18 claims
- 1552US2022305170A1Wound-covering material and production method thereforOJL HOLDINGS CORP·Filed 2020·Application pending·0 cites
- 1649US12310076B2Silicon carbide semiconductor device, power conversion apparatus, and method for manufacturing silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted May 20, 2025·0 cites·13 claims
- 1747US9972676B2Silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted May 15, 2018·0 cites·10 claims
- 1847US2020332143A1Cellulose fiber-containing composition and paintOJI HOLDINGS CORP·Filed 2017·Application pending·0 cites
- 1946US12051744B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 30, 2024·0 cites·18 claims
- 2046US9773874B2Silicon carbide semiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Sep 26, 2017·0 cites·6 claims
- 2146US2021222367A1Cellulose fiber-containing compositionOJI HOLDINGS CORP·Filed 2017·Application pending·0 cites
- 2245US11643475B2Thickener, composition, and sheetOJI HOLDINGS CORP·Filed 2017·Granted May 9, 2023·0 cites·11 claims
- 2345US9954072B2Silicon-carbide semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Apr 24, 2018·0 cites·12 claims
- 2445US2023215942A1Semiconductor device, power conversion apparatus, and method for producing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 2545US2023290874A1Method of manufacturing silicon carbide semiconductor device, silicon carbide semiconductor device, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 2643US2022024826A1Fibrous celluloseOJI HOLDINGS CORP·Filed 2019·Application pending·0 cites
- 2742US11848358B2Silicon carbide semiconductor device and method of manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 19, 2023·0 cites·13 claims
- 2842US11251299B2Silicon carbide semiconductor device and manufacturing method of sameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 15, 2022·0 cites·15 claims
- 2942US2021222366A1Cellulose fiber-containing composition and sheetOJI HOLDINGS CORP·Filed 2017·Application pending·0 cites
- 3042US2016211334A1Silicon carbide semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2014·Application pending·0 cites
- 3140US11637184B2Silicon carbide semiconductor device, power converter, method of manufacturing silicon carbide semiconductor device, and method of manufacturing power converterMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 25, 2023·0 cites·4 claims
- 3239US10199457B2Silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 5, 2019·0 cites·17 claims
- 3337US10347724B2Silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 9, 2019·0 cites·11 claims
- 3437US10312233B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 4, 2019·0 cites·9 claims
- 3536US11158704B2Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 26, 2021·0 cites·19 claims
- 3634US10453951B2Semiconductor device having a gate trench and an outside trenchMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Oct 22, 2019·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →