Inventor · disambiguated record
Ritsuji Toba
Also filed as: TOBA RITSUJI
6 granted patents·197 citations·filing 1986–1991
85Inventor score
Files withHITACHI LTD6
Top patents by PatentIndex Score
6 records- 0193US4642161AMethod of bonding copper and resinHITACHI LTD·Filed 1986·Granted Feb 10, 1987·113 cites·11 claims
- 0280US5028513AProcess for producing printed circuit boardHITACHI LTD·Filed 1989·Granted Jul 2, 1991·40 cites·21 claims
- 0364US4865888AProcess for electroless copper plating and apparatus used thereforHITACHI LTD·Filed 1988·Granted Sep 12, 1989·23 cites·21 claims
- 0436US5045353AMethod for treating interior surfaces of holes and apparatus thereforHITACHI LTD·Filed 1989·Granted Sep 3, 1991·10 cites·8 claims
- 0534US5139923AMethod for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereonHITACHI LTD·Filed 1991·Granted Aug 18, 1992·5 cites·13 claims
- 0629US4781943AProcess for pretreatment before plating through-holes of printed circuit boardsHITACHI LTD·Filed 1987·Granted Nov 1, 1988·6 cites·27 claims
Join the waitlist — get patent alerts
Get an alert when Ritsuji Toba files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →