Inventor · disambiguated record
Richard Trevino
Also filed as: TREVINO RICHARD · TREVINO RICHARD SCOTT
4 granted patents·2 pending applications·68 citations·filing 2002–2025
75Inventor score
Top patents by PatentIndex Score
6 records- 0191US6953999B2High density chip level package for the packaging of integrated circuits and method to manufacture sameKULICKE & SOFFA INVESTMENTS·Filed 2005·Granted Oct 11, 2005·35 cites·18 claims
- 0279US6872589B2High density chip level package for the packaging of integrated circuits and method to manufacture sameKULICKE & SOFFA INVESTMENTS·Filed 2003·Granted Mar 29, 2005·31 cites·15 claims
- 0377US2025352212A1Device and method of creating a fluid containment field for administering therapeutics to a nerveNEURAPTIVE THERAPEUTICS INC·Filed 2025·Application pending·0 cites
- 0475US11633188B2Device and method of creating a fluid containment field for administering therapeutics to a nerveNEURAPTIVE THERAPEUTICS INC·Filed 2018·Granted Apr 25, 2023·2 cites·17 claims
- 0572US12383273B2Device and method of creating a fluid containment field for administering therapeutics to a nerveNEURAPTIVE THERAPEUTICS INC·Filed 2023·Granted Aug 12, 2025·0 cites·12 claims
- 0632US2003197285A1High density substrate for the packaging of integrated circuitsKULICKE & SOFFA INVESTMENTS·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →