Inventor · disambiguated record
Ricardo Villalaz
Also filed as: VILLALAZ RICARDO
1 granted patent·1 pending application·21 citations·filing 2002–2003
43Inventor score
Technology areasG02B
Files withGEORGIA TECH RES INST1
Top patents by PatentIndex Score
2 records- 0181US6788867B2Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabricationGEORGIA TECH RES INST·Filed 2003·Granted Sep 7, 2004·21 cites·19 claims
- 0239US2003012539A1Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabricationFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →