Inventor · disambiguated record
Richard L. Wheeler
Also filed as: WHEELER RICHARD L · WHEELER RICHARD LYNN
21 granted patents·2 pending applications·691 citations·filing 1989–2013
96Inventor score
Top patents by PatentIndex Score
23 records- 0193US5508938ASpecial interconnect layer employing offset trace layout for advanced multi-chip module packagesFUJITSU LTD·Filed 1993·Granted Apr 16, 1996·163 cites·8 claims
- 0292US5514906AApparatus for cooling semiconductor chips in multichip modulesFUJITSU LTD·Filed 1993·Granted May 7, 1996·158 cites·40 claims
- 0381US6025647AApparatus for equalizing signal parameters in flip chip redistribution layersVLSI TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·65 cites·30 claims
- 0480US8395903B1Interconnect pattern for semiconductor packagingWU PAUL YING-FUNG·Filed 2006·Granted Mar 12, 2013·9 cites·5 claims
- 0580US5455064AProcess for fabricating a substrate with thin film capacitor and insulating plugFUJITSU LTD·Filed 1993·Granted Oct 3, 1995·57 cites·4 claims
- 0678US6034332APower supply distribution structure for integrated circuit chip modulesFUJITSU LTD·Filed 1998·Granted Mar 7, 2000·47 cites·13 claims
- 0777US8386229B1Integrated circuit package component and ball grid array simulation modelXILINX INC·Filed 2009·Granted Feb 26, 2013·8 cites·17 claims
- 0874US5817533AHigh-yield methods of fabricating large substrate capacitorsFUJITSU LTD·Filed 1996·Granted Oct 6, 1998·43 cites·26 claims
- 0970US5113314AHigh-speed, high-density chip mountingHEWLETT PACKARD CO·Filed 1991·Granted May 12, 1992·44 cites·12 claims
- 1067US9391833B2Fault signaling for ethernetKRZANOWSKI ROMAN·Filed 2011·Granted Jul 12, 2016·2 cites·20 claims
- 1164US8743559B1Interconnect pattern for semiconductor packagingXILINX INC·Filed 2013·Granted Jun 3, 2014·1 cites·20 claims
- 1263US5652693ASubstrate with thin film capacitor and insulating plugFUJITSU LTD·Filed 1995·Granted Jul 29, 1997·25 cites·8 claims
- 1359US6754616B1Method of emulating an ideal transformer valid from DC to infinite frequencyFUJITSU LTD·Filed 2000·Granted Jun 22, 2004·7 cites·16 claims
- 1458US5765279AMethods of manufacturing power supply distribution structures for multichip modulesFUJITSU LTD·Filed 1995·Granted Jun 16, 1998·20 cites·48 claims
- 1557US6441640B1CMOS-microprocessor chip and package anti-resonance pass-band shunt apparatusSUN MICROSYSTEMS INC·Filed 2001·Granted Aug 27, 2002·6 cites·9 claims
- 1652US6871290B2Method for reducing a magnitude of a rate of current change of an integrated circuitSUN MICROSYSTEMS INC·Filed 2001·Granted Mar 22, 2005·5 cites·15 claims
- 1752US6483341B2CMOS-microprocessor chip and package anti-resonance apparatusSUN MICROSYSTEMS INC·Filed 2001·Granted Nov 19, 2002·9 cites·6 claims
- 1849US6456107B1CMOS-microprocessor chip and package anti-resonance methodSUN MICROSYSTEMS INC·Filed 2001·Granted Sep 24, 2002·7 cites·5 claims
- 1943US5701071ASystems for controlling power consumption in integrated circuitsFUJITSU LTD·Filed 1995·Granted Dec 23, 1997·9 cites·27 claims
- 2040US2015023349A1Packet discovery and learning for vlan provisioningWHEELER RICHARD LYNN·Filed 2013·Application pending·0 cites
- 2137US7372627B1Holder for field glassesWHEELER RICHARD L·Filed 2006·Granted May 13, 2008·0 cites·14 claims
- 2236US4987322ADriver-receiver pair for low noise digital signalingHEWLETT PACKARD CO·Filed 1989·Granted Jan 22, 1991·6 cites·9 claims
- 2333US2003034817A1Apparatus for reducing a magnitude of a rate of current change of an integrated circuitFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →