Inventor · disambiguated record
Ricardo Yandoc
Also filed as: YANDOC RICARDO · YANDOC RICARDO L · YANDOC RICARDO LAGMAY
15 granted patents·25 pending applications·4 citations·filing 2018–2025
84Inventor score
Files withNexperia BV40
Top patents by PatentIndex Score
40 records- 0187US11538744B2Cascode semiconductorNexperia BV·Filed 2021·Granted Dec 27, 2022·2 cites·18 claims
- 0274US10825753B2Semiconductor device and method of manufactureNexperia BV·Filed 2018·Granted Nov 3, 2020·2 cites·14 claims
- 0372US2024258207A1Lead frame assembly for a semiconductor deviceNexperia BV·Filed 2024·Application pending·0 cites
- 0464US12293961B2Method of manufacture for a cascode semiconductor deviceNexperia BV·Filed 2022·Granted May 6, 2025·0 cites·17 claims
- 0564US11973009B2Lead frame assembly for a semiconductor deviceNexperia BV·Filed 2020·Granted Apr 30, 2024·0 cites·12 claims
- 0663US2025210579A1Power stage device clipNexperia BV·Filed 2024·Application pending·0 cites
- 0762US2025105226A1Integrated circuit package and method of manufacturing thereofNexperia BV·Filed 2024·Application pending·0 cites
- 0861US2025006693A1Method of manufacturing semiconductor assembliesNexperia BV·Filed 2024·Application pending·0 cites
- 0961US2024429056A1Semiconductor die package and methodNexperia BV·Filed 2024·Application pending·0 cites
- 1058US2024404923A1Die paddleNexperia BV·Filed 2024·Application pending·0 cites
- 1158US2024153838A1Locking Clip, a Semiconductor Device, and a Method of Manufacturing a Semiconductor DeviceNexperia BV·Filed 2023·Application pending·0 cites
- 1254US12224180B2Semiconductor device and a method of manufacturing a semiconductor deviceNexperia BV·Filed 2021·Granted Feb 11, 2025·0 cites·13 claims
- 1354US2024282680A1Die paddle standoffs in semiconductor packagesNexperia BV·Filed 2024·Application pending·0 cites
- 1454US2023223320A1Semiconductor device package and method for manufacturing the sameNexperia BV·Filed 2023·Application pending·0 cites
- 1553US2023154883A1Semiconductor package with improved connection of the pins to the bond pads of the semiconductor dieNexperia BV·Filed 2022·Application pending·0 cites
- 1652US12176275B2Semiconductor device and a method of manufacturing a semiconductor deviceNexperia BV·Filed 2022·Granted Dec 24, 2024·0 cites·17 claims
- 1752US2024145354A1Semiconductor device and a method for manufacturing such semiconductor deviceNexperia BV·Filed 2023·Application pending·0 cites
- 1851US2023402351A1Semiconductor package assembly and a method of manufacturing such semiconductor package assemblyNexperia BV·Filed 2023·Application pending·0 cites
- 1951US2024071780A1Electronic package and manufacturing method thereforNexperia BV·Filed 2023·Application pending·0 cites
- 2050US12159818B2Multi-chip packaged semiconductor deviceNexperia BV·Filed 2022·Granted Dec 3, 2024·0 cites·18 claims
- 2150US11227819B2Cascode semiconductor device and method of manufactureNexperia BV·Filed 2020·Granted Jan 18, 2022·0 cites·18 claims
- 2250US2022293525A1Packaged half-bridge circuitNexperia BV·Filed 2022·Application pending·0 cites
- 2349US11942401B2Half-bridge semiconductor deviceNexperia BV·Filed 2020·Granted Mar 26, 2024·0 cites·19 claims
- 2449US2024178831A1Cascode Switching ModuleNexperia BV·Filed 2023·Application pending·0 cites
- 2549US2025246525A1Dual cooled mosfet for low rdson and low thermal powerNexperia BV·Filed 2025·Application pending·0 cites
- 2649US2023028579A1Semiconductor device and a method of manufacturing of a semiconductor deviceNexperia BV·Filed 2022·Application pending·0 cites
- 2748US2023005846A1Semiconductor device and a method of manufactureNexperia BV·Filed 2022·Application pending·0 cites
- 2846US2023326836A1Semiconductor device package and method for manufacturing the sameNexperia BV·Filed 2023·Application pending·0 cites
- 2946US2023025949A1Semiconductor device and a method of manufacturing of a semiconductor deviceNexperia BV·Filed 2022·Application pending·0 cites
- 3046US2023163053A1Semiconductor device and a method of manufacturing such semiconductor deviceNexperia BV·Filed 2022·Application pending·0 cites
- 3145US11538795B2Cascode semiconductor device and method of manufactureNexperia BV·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 3245US10714413B2Leadframe assembly for a semiconductor deviceNexperia BV·Filed 2019·Granted Jul 14, 2020·0 cites·16 claims
- 3345US2025336776A1Semiconductor device with controlled bond line thickness using spacers and recessesNexperia BV·Filed 2025·Application pending·0 cites
- 3444US2025336781A1Semiconductor Package and a Method of Manufacturing the Semiconductor PackageNexperia BV·Filed 2025·Application pending·0 cites
- 3543US12347751B2Semiconductor device and a method of manufactureNexperia BV·Filed 2021·Granted Jul 1, 2025·0 cites·19 claims
- 3642US10665532B2Power apparatusNexperia BV·Filed 2018·Granted May 26, 2020·0 cites·16 claims
- 3742US2025239557A1ClipNexperia BV·Filed 2025·Application pending·0 cites
- 3841US10957632B2Lead frame assembly for a semiconductor deviceNexperia BV·Filed 2019·Granted Mar 23, 2021·0 cites·19 claims
- 3940US2019189544A1Semiconductor package and method of manufactureNexperia BV·Filed 2018·Application pending·0 cites
- 4035US11728179B2Surface mount semiconductor device and method of manufactureNexperia BV·Filed 2018·Granted Aug 15, 2023·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →