Inventor · disambiguated record
Rieka Yoshino
Also filed as: YOSHINO RIEKA
3 granted patents·102 citations·filing 1997–1999
76Inventor score
Technology areasH10W
Files withNEC CORP3
Top patents by PatentIndex Score
3 records- 0175US5959362ADevice mounting a semiconductor element on a wiring substrate including an adhesive material having first and second adhesive components with different cure characteristicsNEC CORP·Filed 1997·Granted Sep 28, 1999·52 cites·7 claims
- 0261US6063649ADevice mounting a semiconductor element on a wiring substrate and manufacturing method thereofNEC CORP·Filed 1999·Granted May 16, 2000·27 cites·8 claims
- 0356US5994165AMethod for mounting a semiconductor chipNEC CORP·Filed 1998·Granted Nov 30, 1999·23 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Rieka Yoshino files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →