Inventor · disambiguated record
Robert Bauer
Also filed as: BAUER ROBERT · BAUER ROBERT E
18 granted patents·5 pending applications·317 citations·filing 1974–2018
94Inventor score
Files withBAUER ROBERT6INFINEON TECHNOLOGIES AG4BETHLEHEM STEEL CORP2FREESCALE SEMICONDUCTOR INC2NISSAN DESIGN AMERICA INC2
Top patents by PatentIndex Score
23 records- 0194USD434364SVehicle roof rackNISSAN DESIGN INT INC·Filed 1999·Granted Nov 28, 2000·76 cites·1 claims
- 0293US9816571B1Bi-directional magnetic clutchNORTHROP GRUMMAN SYSTEMS CORP·Filed 2017·Granted Nov 14, 2017·6 cites·19 claims
- 0393USD481003SVehicle roof rackNISSAN DESIGN AMERICA INC·Filed 2001·Granted Oct 21, 2003·62 cites·1 claims
- 0488US6561397B1Vehicle roof rack systemNISSAN DESIGN AMERICA INC·Filed 1999·Granted May 13, 2003·78 cites·39 claims
- 0586US7772036B2Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 10, 2010·16 cites·9 claims
- 0685US10676172B1Deployable wing for an aircraftKEAVNEY THOMAS E·Filed 2018·Granted Jun 9, 2020·9 cites·21 claims
- 0776US9809295B1Flight actuated door sealBAUER ROBERT E·Filed 2016·Granted Nov 7, 2017·4 cites·20 claims
- 0875US4166285AElectrical capacitor with a pleated metallized portion and a starting portion wound about the lead wiresILLINOIS TOOL WORKS·Filed 1978·Granted Aug 28, 1979·18 cites·6 claims
- 0968US8004069B2Lead frame based semiconductor package and a method of manufacturing the sameFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 23, 2011·4 cites·20 claims
- 1066US8659146B2Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturingBAUER ROBERT·Filed 2010·Granted Feb 25, 2014·2 cites·19 claims
- 1163US8456023B2Semiconductor wafer processingBAUER ROBERT·Filed 2007·Granted Jun 4, 2013·3 cites·20 claims
- 1263US4462533AMethod of reconditioning welded jointsBETHLEHEM STEEL CORP·Filed 1982·Granted Jul 31, 1984·19 cites·5 claims
- 1361US3988175ASoldering flux and methodBETHLEHEM STEEL CORP·Filed 1974·Granted Oct 26, 1976·14 cites·15 claims
- 1448US7190077B2Semiconductor structure integrated under a padINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 13, 2007·6 cites·18 claims
- 1546US9219031B2Chip arrangement, and method for forming a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 22, 2015·0 cites·31 claims
- 1646US8283762B2Lead frame based semiconductor package and a method of manufacturing the sameBAUER ROBERT·Filed 2011·Granted Oct 9, 2012·0 cites·20 claims
- 1740US10867893B2Semiconductor devices and methods for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 15, 2020·0 cites·26 claims
- 1839US2015380353A1Method of fabricating an integrated circuit device, and an integrated circuit device therefromBAUER ROBERT·Filed 2013·Application pending·0 cites
- 1939US2010283110A1Integrated sensor chip unitINFINEON TECHNOLOGIES AG·Filed 2010·Application pending·0 cites
- 2037US2006157701A1Integrated sensor chip unitBAUER ROBERT·Filed 2006·Application pending·0 cites
- 2136US8947887B2Package assembly and method of tuning a natural resonant frequency of a packageBAUER ROBERT·Filed 2009·Granted Feb 3, 2015·0 cites·13 claims
- 2236US2003143811A1Method for radiation hardening N-channel MOS transistorsFiled 2003·Application pending·0 cites
- 2335US2003036236A1Method for radiation hardening N-channel MOS transistorsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →