Inventor · disambiguated record
Robert H. Bond
Also filed as: BOND ROBERT · BOND ROBERT H · BOND ROBERT HENRY
33 granted patents·1,099 citations·filing 1976–2013
98Inventor score
Files withSGS THOMSON MICROELECTRONICS9BOND ROBERT HENRY4THOMSON COMPONENTS MOSTEK CORP4GEN KINEMATICS CORP3ST MICROELECTRONICS INC3
Top patents by PatentIndex Score
33 records- 0197US5642261ABall-grid-array integrated circuit package with solder-connected thermal conductorSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Jun 24, 1997·283 cites·22 claims
- 0292US4627151AAutomatic assembly of integrated circuitsTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Dec 9, 1986·76 cites·7 claims
- 0391US8378508B2Integrally molded die and bezel structure for fingerprint sensors and the likeAUTHENTEC INC·Filed 2010·Granted Feb 19, 2013·17 cites·24 claims
- 0491US5991156ABall grid array integrated circuit package with high thermal conductivityST MICROELECTRONICS INC·Filed 1994·Granted Nov 23, 1999·112 cites·10 claims
- 0589US8803258B2Finger sensor including capacitive lens and associated methodsGOZZINI GIOVANNI·Filed 2011·Granted Aug 12, 2014·11 cites·24 claims
- 0689US4915565AManipulation and handling of integrated circuit diceSGS THOMSON MICROELECTRONICS·Filed 1989·Granted Apr 10, 1990·99 cites·5 claims
- 0787US8569875B2Integrally molded die and bezel structure for fingerprint sensors and the likeAPPLE INC·Filed 2013·Granted Oct 29, 2013·10 cites·21 claims
- 0886US6889813B1Material transport methodAMKOR TECHNOLOGY INC·Filed 2000·Granted May 10, 2005·39 cites·38 claims
- 0983US4860816AControl system for vibratory apparatusGEN KINEMATICS CORP·Filed 1988·Granted Aug 29, 1989·20 cites·13 claims
- 1083US4722060AIntegrated-circuit leadframe adapted for a simultaneous bonding operationTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Jan 26, 1988·65 cites·5 claims
- 1180US8471345B2Biometric sensor assembly with integrated visual indicatorBOND ROBERT HENRY·Filed 2010·Granted Jun 25, 2013·6 cites·36 claims
- 1276US5642265ABall grid array package with detachable moduleSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Jun 24, 1997·44 cites·14 claims
- 1375US8836478B2Electronic device including finger sensor and related methodsBOND ROBERT H·Filed 2011·Granted Sep 16, 2014·5 cites·29 claims
- 1475US5693572ABall grid array integrated circuit package with high thermal conductivitySGS THOMSON MICROELECTRONICS·Filed 1996·Granted Dec 2, 1997·44 cites·11 claims
- 1569US4087308AApparatus and method for making reinforced elastomeric fabricSTEELASTIC CO·Filed 1976·Granted May 2, 1978·23 cites·44 claims
- 1667US8582837B2Pseudo-translucent integrated circuit packageBOND ROBERT HENRY·Filed 2009·Granted Nov 12, 2013·6 cites·22 claims
- 1767US5994774ASurface mountable integrated circuit package with detachable module and interposerST MICROELECTRONICS INC·Filed 1997·Granted Nov 30, 1999·33 cites·20 claims
- 1867US5724728AMethod of mounting an integrated circuit to a mounting surfaceSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Mar 10, 1998·29 cites·6 claims
- 1967US4627787AChip selection in automatic assembly of integrated circuitTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Dec 9, 1986·27 cites·6 claims
- 2065US4759675AChip selection in automatic assembly of integrated circuitSGS THOMSON MICROELECTRONICS·Filed 1986·Granted Jul 26, 1988·29 cites·5 claims
- 2160US8772884B2Integrally molded die and bezel structure for fingerprint sensors and the likeAPPLE INC·Filed 2013·Granted Jul 8, 2014·1 cites·32 claims
- 2259USD652333SMolded fingerprint sensor structureBOND ROBERT HENRY·Filed 2010·Granted Jan 17, 2012·11 cites·1 claims
- 2359US4685504AFoundry sand feeding apparatusGEN KINEMATICS CORP·Filed 1984·Granted Aug 11, 1987·15 cites·4 claims
- 2458US5111935AUniversal leadframe carrierSGS THOMSON MICROELECTRONICS·Filed 1988·Granted May 12, 1992·24 cites·8 claims
- 2556USD652332SMolded fingerprint sensor structure with indicia regionsBOND ROBERT HENRY·Filed 2010·Granted Jan 17, 2012·10 cites·1 claims
- 2652US4662425AVibratory part scrubber and methodGEN KINEMATICS CORP·Filed 1986·Granted May 5, 1987·6 cites·8 claims
- 2750US7456050B2System and method for controlling integrated circuit die height and planarityST MICROELECTRONICS INC·Filed 2003·Granted Nov 25, 2008·4 cites·6 claims
- 2849US4626167AManipulation and handling of integrated circuit diceTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Dec 2, 1986·15 cites·5 claims
- 2944US9235747B2Integrated leadframe and bezel structure and device formed from sameBOND ROBERT·Filed 2008·Granted Jan 12, 2016·0 cites·27 claims
- 3044US4743956AOffset bending of curvaceously planar radiating leadframe leads in semiconductor chip packagingTHOMSON COMPONENTS MOSTER CORP·Filed 1986·Granted May 10, 1988·16 cites·4 claims
- 3141US4926538AUniversal nest for a connector assembly toolAMERICAN TELEPHONE & TELEGRAPH·Filed 1989·Granted May 22, 1990·7 cites·7 claims
- 3234US4815595AUniform leadframe carrierSGS THOMSON MICROELECTRONICS·Filed 1988·Granted Mar 28, 1989·6 cites·6 claims
- 3333US5182851AMethod for holding a strip of conductive lead framesSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Feb 2, 1993·6 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →