Inventor · disambiguated record
Roy V. Buck
Also filed as: BUCK JR ROY V · BUCK JR ROY VESPER · BUCK ROY V
6 granted patents·1 pending application·163 citations·filing 1989–2012
84Inventor score
Top patents by PatentIndex Score
7 records- 0181US5489854AIC chip test socket with double-ended spring biased contactsANALOG DEVICES INC·Filed 1993·Granted Feb 6, 1996·69 cites·16 claims
- 0275US6163462AStress relief substrate for solder ball grid array mounted circuits and method of packagingANALOG DEVICES INC·Filed 1997·Granted Dec 19, 2000·44 cites·19 claims
- 0364US4957583AApparatus for etching patterned substratesANALOG DEVICES INC·Filed 1989·Granted Sep 18, 1990·35 cites·3 claims
- 0455US6476471B1Microelectronic-device assemblies and methods that exclude extraneous elements from sensitive areasANALOG DEVICES INC·Filed 2000·Granted Nov 5, 2002·8 cites·19 claims
- 0551US7777313B2Electronic package structures and methodsANALOG DEVICES INC·Filed 2006·Granted Aug 17, 2010·1 cites·5 claims
- 0632US2014013843A1Inertial Sensor Mounting SystemBUCK ROY V·Filed 2012·Application pending·0 cites
- 0724US5021120AProcess for etching patterned substratesBUCK ROY V·Filed 1990·Granted Jun 4, 1991·6 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →