Inventor · disambiguated record

Robert Vinson Burress

Also filed as: BURRESS ROBERT VINSON

2 granted patents·571 citations·filing 2000–2001

74Inventor score

Technology areasH10W

Files withCAPOTE MIGUEL ALBERT2

Top patents by PatentIndex Score

2 records

0197US6335571B1Semiconductor flip-chip package and method for the fabrication thereofCAPOTE MIGUEL ALBERT·Filed 2000·Granted Jan 1, 2002·399 cites·10 claims
0295US6399426B1Semiconductor flip-chip package and method for the fabrication thereofCAPOTE MIGUEL ALBERT·Filed 2001·Granted Jun 4, 2002·172 cites·4 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →