Inventor · disambiguated record
Robert Felix Bywalez
Also filed as: BYWALEZ ROBERT FELIX
4 granted patents·2 pending applications·0 citations·filing 2020–2021
53Inventor score
Top patents by PatentIndex Score
6 records- 0154US12451861B2Wafer level packageRF360 SINGAPORE PTE LTD·Filed 2020·Granted Oct 21, 2025·0 cites·10 claims
- 0246US12074120B2Electric component with pad for a bump and manufacturing method thereofRF360 SINGAPORE PTE LTD·Filed 2020·Granted Aug 27, 2024·0 cites·17 claims
- 0346US11967938B2Corrosion resistant pad for enhanced thin film acoustic packaging (TFAP)RF360 SINGAPORE PTE LTD·Filed 2021·Granted Apr 23, 2024·0 cites·56 claims
- 0442US11984871B2Package comprising stacked filtersRF360 SINGAPORE PTE LTD·Filed 2020·Granted May 14, 2024·0 cites·20 claims
- 0541US2023058875A1Wideband-enabled electroacoustic deviceRF360 Europe GmbH·Filed 2021·Application pending·0 cites
- 0637US2022140812A1Multi mirror stackRF360 Europe GmbH·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →