Inventor · disambiguated record
Rongwang Dai
Also filed as: Dai Rongwang
0 granted patents·9 pending applications·0 citations·filing 2022–2024
Files withZING SEMICONDUCTOR CORP9
Top patents by PatentIndex Score
9 records- 0164US2024218564A1Crystal growing method, apparatus and rf-soi substrateZING SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 0263US2024096645A1Soi waferZING SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 0355US2023134308A1Soi wafer and method of final processing the sameZING SEMICONDUCTOR CORP·Filed 2022·Application pending·0 cites
- 0455US2024387171A1Structure of high-resistivity silicon-on-insulator embedded with charge capture layer and manufacture thereofZING SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0554US2024387241A1Structure of high-resistivity silicon-on-insulator embedded with charge capture layer and manufacture thereofZING SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0647US2023178366A1Semiconductor substrate and manufacture thereofZING SEMICONDUCTOR CORP·Filed 2022·Application pending·0 cites
- 0744US2023133916A1Process of surface treatment of soi waferZING SEMICONDUCTOR CORP·Filed 2022·Application pending·0 cites
- 0844US2023137599A1Surface treatment of soi waferZING SEMICONDUCTOR CORP·Filed 2022·Application pending·0 cites
- 0943US2023133092A1Soi structured semiconductor silicon wafer and method of making the sameZING SEMICONDUCTOR CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →