Inventor · disambiguated record
Robin Davis
Also filed as: DAVIS ROBIN · DAVIS ROBIN R
15 granted patents·6 pending applications·15 citations·filing 2008–2025
87Inventor score
Top patents by PatentIndex Score
21 records- 0194US12205881B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2023·Granted Jan 21, 2025·2 cites·30 claims
- 0293US11616003B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Mar 28, 2023·2 cites·18 claims
- 0389US11302212B1Device for teaching music performance through tactile pitch association and methods of useDAVIS ROBIN·Filed 2021·Granted Apr 12, 2022·4 cites·20 claims
- 0488US11728248B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 0577US12438065B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2023·Granted Oct 7, 2025·0 cites·26 claims
- 0676US12469776B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2025·Granted Nov 11, 2025·0 cites·20 claims
- 0774US12300561B2Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2024·Granted May 13, 2025·0 cites·21 claims
- 0872US7568704B1Method of playing blackjack with a bonus betDAVIS DAVID A·Filed 2008·Granted Aug 4, 2009·6 cites·7 claims
- 0972US2025273526A1Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 1069US12057373B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the sameDECA TECH USA INC·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1168US12170261B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Dec 17, 2024·0 cites·30 claims
- 1268US11973051B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Apr 30, 2024·0 cites·30 claims
- 1363US12500197B2Encapsulant-defined land grid array (LGA) package and method for making the sameDECA TECH USA INC·Filed 2023·Granted Dec 16, 2025·0 cites·22 claims
- 1462US2024404840A1Molded direct contact interconnect substrate and methods of making sameDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 1562US2024395673A1Stackable fully molded semiconductor structure with through vertical interconnectsDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 1660US2025112141A1Quad flat no-lead (qfn) package without leadframe and with layer of dielectricDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 1759US12062550B2Molded direct contact interconnect substrate and methods of making sameDECA TECH USA INC·Filed 2023·Granted Aug 13, 2024·0 cites·28 claims
- 1859US2024243089A1Layered molded direct contact and dielectric structure and method for making the sameDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 1957US2024030174A1Quad flat no-lead (qfn) package with backside conductive material and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2023·Application pending·0 cites
- 2054US11749534B1Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2022·Granted Sep 5, 2023·0 cites·29 claims
- 2151US12500198B2Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2025·Granted Dec 16, 2025·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →