Inventor · disambiguated record
Ronald S. Demcko
Also filed as: DEMCKO RONALD · DEMCKO RONALD S · DEMCKO RONALD STEPHAN
6 granted patents·6 pending applications·20 citations·filing 2005–2024
76Inventor score
Top patents by PatentIndex Score
12 records- 0191US11664159B2Component array including one or more heat sink layersAVX CORP·Filed 2021·Granted May 30, 2023·4 cites·23 claims
- 0279US8699204B2Element array and footprint layout for element arrayDEMCKO RONALD S·Filed 2011·Granted Apr 15, 2014·7 cites·11 claims
- 0375US7724496B2Multilayer vertically integrated array technologyAVX CORP·Filed 2006·Granted May 25, 2010·9 cites·43 claims
- 0472US12243687B2Component array including one or more heat sink layersKYOCERA AVX COMPONENTS CORP·Filed 2023·Granted Mar 4, 2025·0 cites·22 claims
- 0560US2024292540A1Multicomponent ConnectorKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 0654US2024032185A1Heat Sink Component TerminationsKYOCERA AVX COMPONENTS CORP·Filed 2023·Application pending·0 cites
- 0753US11688967B2Wire termination device for coupling a wire to a feedthrough device and system including the sameAVX CORP·Filed 2020·Granted Jun 27, 2023·0 cites·20 claims
- 0853US2024314928A1Ultra-Thin Sandwich ComponentKYOCERA AVX COMPONENTS CORP·Filed 2024·Application pending·0 cites
- 0953US2024234591A9Metal-Oxide-Semiconductor CapacitorKYOCERA AVX COMPONENTS CORP·Filed 2023·Application pending·0 cites
- 1051US2023076503A1Electronically Insulating Thermal Connector having a Low Thermal ResistivityKYOCERA AVX COMPONENTS CORP·Filed 2022·Application pending·0 cites
- 1147US10886091B2Feedthrough device including a gas discharge tubeAVX CORP·Filed 2019·Granted Jan 5, 2021·0 cites·16 claims
- 1233US2005180091A1High current feedthru deviceAVX CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →