Inventor · disambiguated record
Ronnie M. De Villa
Also filed as: DE VILLA RONNIE M
1 granted patent·7 pending applications·0 citations·filing 2020–2023
8Inventor score
Files withUTAC HEADQUARTERS PTE LTD8
Top patents by PatentIndex Score
8 records- 0150US2025038037A1Wafer lamination systems and methods thereof for semiconductor wafersUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0248US2023343668A1Semiconductor Packages and Methods of Forming RDL and Side and Back Protection for Semiconductor DeviceUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0346US2023274979A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0445US2023178413A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 0545US2023154795A1Frame mask for singulating wafers by plasma etchingUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 0643US2023377896A1Back surface plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0742US11710661B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2020·Granted Jul 25, 2023·0 cites·20 claims
- 0840US2023154796A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →