Inventor · disambiguated record
Robert D. Edwards
Also filed as: EDWARDS ROBERT D · EDWARDS ROBERT DANIEL
11 granted patents·2 pending applications·213 citations·filing 1996–2016
88Inventor score
Top patents by PatentIndex Score
13 records- 0197US6383920B1Process of enclosing via for improved reliability in dual damascene interconnectsIBM·Filed 2001·Granted May 7, 2002·179 cites·27 claims
- 0275US9354252B2Pressure sensing and control for semiconductor wafer probingIBM·Filed 2014·Granted May 31, 2016·2 cites·20 claims
- 0372US8963567B2Pressure sensing and control for semiconductor wafer probingEDWARDS ROBERT D·Filed 2011·Granted Feb 24, 2015·2 cites·17 claims
- 0471US9673089B2Interconnect structure with enhanced reliabilityIBM·Filed 2014·Granted Jun 6, 2017·2 cites·20 claims
- 0569US8053257B2Method for prediction of premature dielectric breakdown in a semiconductorIBM·Filed 2008·Granted Nov 8, 2011·5 cites·11 claims
- 0667US8912658B2Interconnect structure with enhanced reliabilityFILIPPI RONALD·Filed 2010·Granted Dec 16, 2014·2 cites·12 claims
- 0764US7919834B2Edge seal for thru-silicon-via technologyIBM·Filed 2007·Granted Apr 5, 2011·4 cites·9 claims
- 0858US9702930B2Semiconductor wafer probing system including pressure sensing and control unitIBM·Filed 2016·Granted Jul 11, 2017·0 cites·20 claims
- 0958US7602265B2Apparatus for accurate and efficient quality and reliability evaluation of micro electromechanical systemsIBM·Filed 2005·Granted Oct 13, 2009·2 cites·3 claims
- 1049US5760595AHigh temperature electromigration stress test system, test socket, and use thereofIBM·Filed 1996·Granted Jun 2, 1998·15 cites·9 claims
- 1147US9059111B2Reliable back-side-metal structureIBM·Filed 2013·Granted Jun 16, 2015·0 cites·10 claims
- 1241US2006281338A1Method for prediction of premature dielectric breakdown in a semiconductorIBM·Filed 2005·Application pending·0 cites
- 1335US2002163062A1Multiple material stacks with a stress relief layer between a metal structure and a passivation layerIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →