Inventor · disambiguated record
Ronald W. Ellis
Also filed as: ELLIS RONALD W
11 granted patents·78 citations·filing 1997–2002
90Inventor score
Files withMICRON TECHNOLOGY INC11
Top patents by PatentIndex Score
11 records- 0174US6199743B1Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 13, 2001·37 cites·6 claims
- 0261US6390350B2Quick change precisorMICRON TECHNOLOGY INC·Filed 2001·Granted May 21, 2002·6 cites·22 claims
- 0359US6357275B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 19, 2002·5 cites·9 claims
- 0455US6454153B2Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·5 cites·20 claims
- 0553US6509205B2Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 21, 2003·3 cites·20 claims
- 0651US5971256AQuick change precisorMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 26, 1999·12 cites·7 claims
- 0746US6607121B2Quick change precisorMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 19, 2003·1 cites·20 claims
- 0844US6474532B2Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 5, 2002·1 cites·25 claims
- 0941US6237830B1Quick change precisorMICRON TECHNOLOGY INC·Filed 1999·Granted May 29, 2001·6 cites·25 claims
- 1039US6504257B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 7, 2003·0 cites·20 claims
- 1133US6221748B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 24, 2001·2 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →