Inventor · disambiguated record
Robin E. Gorrell
Also filed as: GORRELL ROBIN · GORRELL ROBIN E
15 granted patents·8 pending applications·447 citations·filing 1992–2024
93Inventor score
Files with3M INNOVATIVE PROPERTIES CO10GORE & ASS63M INNOVATIVE PROPERTIES COMPANY1CELLINK CORP1PALANISWAMY RAVI1
Top patents by PatentIndex Score
23 records- 0192US5786270AMethod of forming raised metallic contacts on electrical circuits for permanent bondingGORE & ASS·Filed 1996·Granted Jul 28, 1998·88 cites·7 claims
- 0286US5847327ADimensionally stable core for use in high density chip packagesGORE & ASS·Filed 1996·Granted Dec 8, 1998·77 cites·9 claims
- 0384US5276955AMultilayer interconnect system for an area array interconnection using solid state diffusionSUPERCOMPUTER SYSTEMS LTD·Filed 1992·Granted Jan 11, 1994·99 cites·29 claims
- 0482US10653006B2Electrical conductors3M INNOVATIVE PROPERTIES CO·Filed 2015·Granted May 12, 2020·3 cites·5 claims
- 0582US5747358AMethod of forming raised metallic contacts on electrical circuitsGORE & ASS·Filed 1996·Granted May 5, 1998·46 cites·6 claims
- 0681US6344371B2Dimensionally stable core for use in high density chip packages and a method of fabricating sameGORE & ASS·Filed 1998·Granted Feb 5, 2002·57 cites·11 claims
- 0781US5965043AMethod for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-viasGORE & ASS·Filed 1996·Granted Oct 12, 1999·67 cites·31 claims
- 0869US11324113B2Electrical conductors3M INNOVATIVE PROPERTIES CO·Filed 2020·Granted May 3, 2022·0 cites·7 claims
- 0964US10740669B2Film assembly and multilayer stack including antenna3M INNOVATIVE PROPERTIES CO·Filed 2019·Granted Aug 11, 2020·0 cites·4 claims
- 1063US11164063B2Multilayer stack including RFID tag3M INNOVATIVE PROPERTIES CO·Filed 2020·Granted Nov 2, 2021·0 cites·10 claims
- 1156US2025024605A1Forming Welded and Soldered Connections to Flexible Interconnect CircuitsCELLINK CORP·Filed 2024·Application pending·0 cites
- 1254US10628727B2RFID tag on stretchable substrate3M INNOVATIVE PROPERTIES CO·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 1353US10496915B2RFID tag on flexible substrate3M INNOVATIVE PROPERTIES CO·Filed 2015·Granted Dec 3, 2019·0 cites·17 claims
- 1452US12381107B2Protective tapes, articles therefrom, and methods of making and using same3M INNOVATIVE PROPERTIES COMPANY·Filed 2021·Granted Aug 5, 2025·0 cites·18 claims
- 1546US10229353B2RFID tag on stretchable substrate3M INNOVATIVE PROPERTIES CO·Filed 2015·Granted Mar 12, 2019·0 cites·20 claims
- 1644US2014355298A1Adhesive lightguide with resonant circuit3M INNOVATIVE PROPERTIES CO·Filed 2013·Application pending·0 cites
- 1742US5976974AMethod of forming redundant signal traces and corresponding electronic componentsGORE & ASS·Filed 1997·Granted Nov 2, 1999·10 cites·7 claims
- 1842US2011284268A1Flexible circuit coverfilm adhesion enhancementPALANISWAMY RAVI·Filed 2011·Application pending·0 cites
- 1941US2015302990A1Multilayer film including first and second dielectric layers3M INNOVATIVE PROPERTIES CO·Filed 2013·Application pending·0 cites
- 2041US2015294793A1Multilayer film including first and second dielectric layers3M INNOVATIVE PROPERTIES CO·Filed 2013·Application pending·0 cites
- 2135US2004099958A1Crack resistant interconnect moduleFiled 2002·Application pending·0 cites
- 2232US2004104463A1Crack resistant interconnect moduleFiled 2003·Application pending·0 cites
- 2323US2002045036A1Bga solder ball shear strengthFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →