Inventor · disambiguated record
Robert-Christian Hagen
Also filed as: HAGEN ROBERT-CHRISTIAN
22 granted patents·5 pending applications·356 citations·filing 2001–2008
95Inventor score
Top patents by PatentIndex Score
27 records- 0191US6902951B2Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 7, 2005·67 cites·6 claims
- 0290US6710455B2Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 23, 2004·65 cites·15 claims
- 0389US7575173B2Smart card, smart card module, and a method for production of a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 18, 2009·22 cites·6 claims
- 0487US7276783B2Electronic component with a plastic package and method for productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 2, 2007·54 cites·36 claims
- 0586US7517722B2Method of producing a universal semiconductor housing with precrosslinked plastic embedding compoundsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 14, 2009·13 cites·23 claims
- 0682US6867471B2Universal package for an electronic component with a semiconductor chip and method for producing the universal packageINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·33 cites·38 claims
- 0780US6683374B2Electronic component and process for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 27, 2004·30 cites·15 claims
- 0879US7554196B2Plastic package and semiconductor component comprising such a plastic package, and method for its productionINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 30, 2009·10 cites·14 claims
- 0975US7755178B2Base semiconductor component for a semiconductor component stack and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 13, 2010·6 cites·15 claims
- 1073US6949405B2Method for producing channels and cavities in semiconductor housings, and an electronic component having such channels and cavitiesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 27, 2005·19 cites·24 claims
- 1170US7045881B2Electronic component with shielding and method for its productionINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 16, 2006·12 cites·12 claims
- 1269US8659135B2Semiconductor device stack and method for its productionBAUER MICHAEL·Filed 2005·Granted Feb 25, 2014·5 cites·8 claims
- 1354US7795712B2Lead frame with non-conductive connective barINFINEON TECHNOLOGIES AG·Filed 2008·Granted Sep 14, 2010·1 cites·18 claims
- 1454US7190059B2Electronic component with a stack of semiconductor chips and a method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 13, 2007·6 cites·19 claims
- 1551US7700956B2Sensor component and panel used for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 20, 2010·4 cites·8 claims
- 1650US7524699B2Electronic component and a panelINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 28, 2009·4 cites·4 claims
- 1750US2006183306A1Method for producing an electronic component with shieldingINFINEON TECHNOLOGIES AG·Filed 2006·Application pending·0 cites
- 1849US7772105B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 10, 2010·0 cites·8 claims
- 1948US7566968B2Biosensor with smart card configurationSIEMENS AG·Filed 2005·Granted Jul 28, 2009·0 cites·10 claims
- 2047US7508083B2Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 24, 2009·2 cites·25 claims
- 2147US7391103B2Electronic module having plug contacts and method for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 24, 2008·2 cites·21 claims
- 2246US7327023B2Semiconductor component with plastic housing, and process for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 5, 2008·0 cites·12 claims
- 2345US2005184375A1Electronic device configured as a multichip module, leadframe and panel with leadframe positionsINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2443US6953992B2Electronic component with at least one semiconductor chip and method for its manufactureINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 11, 2005·1 cites·8 claims
- 2539US2004043515A1Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housingFiled 2003·Application pending·0 cites
- 2635US2003042591A1Electronic component with at least two stacked semiconductor chips, and fabrication methodFiled 2002·Application pending·0 cites
- 2735US2003043555A1Electronic component with at least two stacked semiconductor chips and process for producing the electronic componentFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →